XC5VSX35T-1FFG665C

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 3096576 34816 665-BBGA, FCBGA

Quantity 456 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2720Number of Logic Elements/Cells34816
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3096576

Overview of XC5VSX35T-1FFG665C – Virtex®-5 SXT Field Programmable Gate Array (FPGA)

The XC5VSX35T-1FFG665C is a Virtex®-5 SXT field programmable gate array (FPGA) from AMD, provided in a 665-ball FCBGA package. It delivers substantial on-chip logic and embedded memory for configurable digital designs.

Key on-device resources include 2,720 configurable logic blocks (CLBs) and 34,816 logic elements, approximately 3.1 Mbits of embedded RAM, and 360 user I/Os. The device is commercial grade, RoHS compliant, and specified for surface-mount assembly in a 665-FCBGA (27×27) package with a core supply range of 0.95 V to 1.05 V and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Core Capacity Approximately 34,816 logic elements and 2,720 CLBs provide the programmable logic fabric for complex functions and custom datapaths.
  • Embedded Memory Approximately 3.1 Mbits (3,096,576 bits) of on-chip RAM for buffering, FIFOs, and lookup tables.
  • Flexible I/O 360 user I/O pins to support multiple external interfaces and parallel connections.
  • Power Core voltage supply specified from 0.95 V to 1.05 V to match system power-rail requirements.
  • Package & Mounting 665-FCBGA (27×27) / 665-BBGA package designed for surface-mount assembly to support dense PCB layouts.
  • Operating Conditions & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic density: 34,816 logic elements and 2,720 CLBs enable substantial programmable logic capacity in a single device, reducing the need for multiple FPGAs.
  • Significant on-chip memory: Approximately 3.1 Mbits of embedded RAM supports local data storage and high-throughput buffering without external memory.
  • Ample I/O availability: 360 I/Os provide the flexibility to connect numerous peripherals, sensors, and high-pin-count interfaces directly.
  • Low-voltage core: Core supply range of 0.95 V–1.05 V aligns with modern power-rail architectures for efficient operation.
  • Compact BGA packaging: 665-FCBGA (27×27) surface-mount package offers a compact footprint for space-constrained PCBs while maintaining high I/O and logic capacity.
  • Commercial and environmental suitability: Commercial temperature rating (0 °C–85 °C) and RoHS compliance support standard commercial product deployments with environmental compliance.

Why Choose XC5VSX35T-1FFG665C?

The XC5VSX35T-1FFG665C combines a high count of logic elements and CLBs with multi-megabit on-chip RAM and a large I/O complement in a compact 665-FCBGA package. As a commercial-grade Virtex®-5 SXT FPGA from AMD, it is suited to designs that require extensive programmable logic, embedded memory, and dense I/O in a surface-mount form factor.

Choosing this device provides a balance of integration and configurability for mid- to high-density FPGA designs, with clear electrical and thermal limits (0.95 V–1.05 V core, 0 °C–85 °C) and RoHS compliance to support commercial production requirements.

Request a quote or submit an inquiry for pricing and availability of the XC5VSX35T-1FFG665C to begin the procurement process.

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