XC5VSX35T-1FFG665I

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 3096576 34816 665-BBGA, FCBGA

Quantity 1,485 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs2720Number of Logic Elements/Cells34816
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3096576

Overview of XC5VSX35T-1FFG665I – Virtex®-5 SXT Field Programmable Gate Array (FPGA), 665-FCBGA (27×27)

The XC5VSX35T-1FFG665I is a Virtex®-5 SXT Field Programmable Gate Array (FPGA) from AMD, offered in a 665-FCBGA (27×27) package and rated for industrial operation. It provides a balance of logic density, embedded memory, and I/O capacity for designs that require substantial on-chip resources within a surface-mount FCBGA package.

The device is specified with 34,816 logic elements, approximately 3.1 Mbits of on-chip RAM, and 360 user I/O, with a core supply range of 0.95 V to 1.05 V and an operating temperature range from −40°C to 100°C.

Key Features

  • Core Architecture  Virtex-5 SXT FPGA family device tailored for high-density programmable logic integration.
  • Logic Resources  Provides 34,816 logic elements organized across 2,720 logic blocks for complex digital designs.
  • Embedded Memory  Approximately 3.1 Mbits of on-chip RAM to support buffers, FIFOs, and local storage.
  • I/O Capacity  360 user I/O pins to support broad peripheral and interface requirements.
  • Power Supply  Core voltage supply specified between 0.95 V and 1.05 V for stable core operation.
  • Package & Mounting  665-FCBGA (27×27) package in a surface-mount form factor for compact board integration.
  • Industrial Temperature Grade  Rated for operation from −40°C to 100°C to meet industrial-temperature deployment needs.
  • Compliance  RoHS compliant to support lead-free assembly and regulatory requirements.

Typical Applications

  • High-density digital processing  Suited for designs that require up to 34,816 logic elements and significant embedded memory for custom compute and dataflow tasks.
  • Interface aggregation  360 user I/O supports aggregation and bridging of multiple external peripherals or buses on a single device.
  • Industrial systems  Industrial-grade temperature range and surface-mount package make it appropriate for industrial control and automation equipment.

Unique Advantages

  • Substantial logic capacity: 34,816 logic elements support complex state machines, pipelined datapaths, and parallel processing without external logic expansion.
  • On-chip RAM for latency-sensitive tasks: Approximately 3.1 Mbits of embedded memory reduces dependence on external memory for buffering and local storage.
  • High I/O count: 360 user I/O pins provide flexibility for interfacing with sensors, transceivers, and external controllers.
  • Industrial temperature rating: Specified operation from −40°C to 100°C supports deployment in temperature-demanding environments.
  • Compact FCBGA footprint: The 665-FCBGA (27×27) surface-mount package enables dense board layouts while maintaining robust connectivity.
  • RoHS compliant: Supports lead-free manufacturing and end-product compliance requirements.

Why Choose XC5VSX35T-1FFG665I?

The XC5VSX35T-1FFG665I positions itself as a capable Virtex-5 SXT FPGA option for engineers who need a combination of significant logic resources, embedded memory, and a high I/O count in an industrial-temperature, surface-mount package. Its specification set supports a range of complex digital designs where on-chip resources and reliable operation across a wide temperature range are priorities.

This device is well suited for teams designing compact, high-density systems that require scalability of logic and memory resources while maintaining compliance with RoHS and industrial temperature requirements.

Request a quote or submit an inquiry to receive pricing and availability details for the XC5VSX35T-1FFG665I.

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