XC5VSX35T-1FFG665I
| Part Description |
Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 3096576 34816 665-BBGA, FCBGA |
|---|---|
| Quantity | 1,485 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 665-FCBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 665-BBGA, FCBGA | Number of I/O | 360 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 2720 | Number of Logic Elements/Cells | 34816 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3096576 |
Overview of XC5VSX35T-1FFG665I – Virtex®-5 SXT Field Programmable Gate Array (FPGA), 665-FCBGA (27×27)
The XC5VSX35T-1FFG665I is a Virtex®-5 SXT Field Programmable Gate Array (FPGA) from AMD, offered in a 665-FCBGA (27×27) package and rated for industrial operation. It provides a balance of logic density, embedded memory, and I/O capacity for designs that require substantial on-chip resources within a surface-mount FCBGA package.
The device is specified with 34,816 logic elements, approximately 3.1 Mbits of on-chip RAM, and 360 user I/O, with a core supply range of 0.95 V to 1.05 V and an operating temperature range from −40°C to 100°C.
Key Features
- Core Architecture Virtex-5 SXT FPGA family device tailored for high-density programmable logic integration.
- Logic Resources Provides 34,816 logic elements organized across 2,720 logic blocks for complex digital designs.
- Embedded Memory Approximately 3.1 Mbits of on-chip RAM to support buffers, FIFOs, and local storage.
- I/O Capacity 360 user I/O pins to support broad peripheral and interface requirements.
- Power Supply Core voltage supply specified between 0.95 V and 1.05 V for stable core operation.
- Package & Mounting 665-FCBGA (27×27) package in a surface-mount form factor for compact board integration.
- Industrial Temperature Grade Rated for operation from −40°C to 100°C to meet industrial-temperature deployment needs.
- Compliance RoHS compliant to support lead-free assembly and regulatory requirements.
Typical Applications
- High-density digital processing Suited for designs that require up to 34,816 logic elements and significant embedded memory for custom compute and dataflow tasks.
- Interface aggregation 360 user I/O supports aggregation and bridging of multiple external peripherals or buses on a single device.
- Industrial systems Industrial-grade temperature range and surface-mount package make it appropriate for industrial control and automation equipment.
Unique Advantages
- Substantial logic capacity: 34,816 logic elements support complex state machines, pipelined datapaths, and parallel processing without external logic expansion.
- On-chip RAM for latency-sensitive tasks: Approximately 3.1 Mbits of embedded memory reduces dependence on external memory for buffering and local storage.
- High I/O count: 360 user I/O pins provide flexibility for interfacing with sensors, transceivers, and external controllers.
- Industrial temperature rating: Specified operation from −40°C to 100°C supports deployment in temperature-demanding environments.
- Compact FCBGA footprint: The 665-FCBGA (27×27) surface-mount package enables dense board layouts while maintaining robust connectivity.
- RoHS compliant: Supports lead-free manufacturing and end-product compliance requirements.
Why Choose XC5VSX35T-1FFG665I?
The XC5VSX35T-1FFG665I positions itself as a capable Virtex-5 SXT FPGA option for engineers who need a combination of significant logic resources, embedded memory, and a high I/O count in an industrial-temperature, surface-mount package. Its specification set supports a range of complex digital designs where on-chip resources and reliable operation across a wide temperature range are priorities.
This device is well suited for teams designing compact, high-density systems that require scalability of logic and memory resources while maintaining compliance with RoHS and industrial temperature requirements.
Request a quote or submit an inquiry to receive pricing and availability details for the XC5VSX35T-1FFG665I.

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