XC5VSX35T-X1FFG665C

The XC5VSX35T-X1FFG665C is a Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC supplied in a 665-ball FCBGA package. It integrates a high logic capacity and on-chip memory with a large I/O count for dense, configurable logic implementations.

Key device parameters include 34,816 logic elements, approximately 3.1 Mbits of embedded memory, 360 user I/Os, a 950 mV–1.05 V supply range, and a commercial operating range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic 34,816 logic elements provide the programmable fabric for implementing complex digital functions.
• Embedded Memory Approximately 3.1 Mbits of on-chip RAM to support buffering, state storage, and intermediate data processing.
• I/O Density 360 user I/Os enable wide connectivity options for parallel interfaces and multi-channel designs.
• Package 665-ball FCBGA (665-FCBGA, 27×27) surface-mount package for compact, board-level integration.
• Power Supply Operates from a supply voltage range of 950 mV to 1.05 V to match system power requirements.
• Temperature & Grade Commercial grade operation from 0 °C to 85 °C for standard electronics applications.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density logic implementations — Ideal where tens of thousands of logic elements and embedded RAM are required to realize complex programmable functions.
• Multi-channel I/O systems — Suited to designs needing a large number of user I/Os for parallel interfaces or multiple peripheral connections.
• Compact board-level modules — The 665-FCBGA package supports space-conscious PCB layouts requiring surface-mount integration.

Unique Advantages

• Significant logic capacity: 34,816 logic elements enable implementation of sizable combinational and sequential logic blocks on a single device.
• On-chip memory provision: Approximately 3.1 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O count: 360 user I/Os provide flexibility for connecting to multiple peripherals, buses, and parallel interfaces.
• Compact packaging: 665-FCBGA (27×27) surface-mount package supports dense board designs while maintaining thermal and signal routing considerations typical for BGA parts.
• Commercial temperature rating: 0 °C to 85 °C operation aligns with standard electronics applications and environments.
• Regulatory compliance: RoHS compliance assists in meeting environmental and manufacturing requirements.

Why Choose XC5VSX35T-X1FFG665C?

The XC5VSX35T-X1FFG665C positions itself as a high-capacity Virtex®-5 SXT FPGA option for applications that require a balance of logic resources, embedded memory, and extensive I/O in a compact FCBGA package. Its specified supply voltage range and commercial temperature rating make it suitable for standard electronic product designs that demand reliable, programmable logic capacity.

This device is well suited to engineers and teams looking to consolidate logic, memory, and I/O needs into a single FPGA package while maintaining compliance with RoHS manufacturing requirements.

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