XC5VSX50T-1FFG1136C

IC FPGA 480 I/O 1136FCBGA
Part Description

Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 480 4866048 52224 1136-BBGA, FCBGA

Quantity 1,514 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package1136-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1136-BBGA, FCBGANumber of I/O480Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4080Number of Logic Elements/Cells52224
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4866048

Overview of XC5VSX50T-1FFG1136C – Virtex®-5 SXT FPGA, 1136-FCBGA (35×35)

The XC5VSX50T-1FFG1136C is a Virtex-5 SXT field programmable gate array (FPGA) from AMD, supplied in a 1136-ball FCBGA package. It provides a high count of programmable logic resources, substantial on-chip memory, and a large I/O footprint suited to designs that require dense logic integration and extensive interfacing.

Key attributes include 52,224 logic elements, approximately 4.9 Mbits of embedded memory, and up to 480 I/O pins, delivered in a surface-mount 1136-FCBGA (35×35) package for compact system integration.

Key Features

  • Core Logic  52,224 logic elements for implementing complex digital logic and custom architectures.
  • Configurable Logic Blocks (CLBs)  4,080 CLBs to structure and distribute programmable logic across the device.
  • Embedded Memory  Approximately 4.9 Mbits (4,866,048 bits) of on-chip RAM to support data buffering, FIFOs, and state storage.
  • I/O Density  480 user I/O pins to support wide buses and multiple peripheral interfaces.
  • Power Supply  Core voltage range 0.95 V to 1.05 V to match system power rails and regulator designs.
  • Package & Mounting  1136-ball BGA, FCBGA package (1136-FCBGA, 35×35 mm) in a surface-mount form factor for board-level assembly.
  • Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS compliant for environmentally regulated assemblies.

Typical Applications

  • Custom logic implementation  Implement application-specific digital functions where a high count of logic elements and CLBs are required.
  • Memory-intensive designs  Use the device's approximately 4.9 Mbits of embedded RAM for buffering, packet storage, and data path staging.
  • High-density I/O interfacing  Leverage 480 I/O pins to connect wide data buses, parallel peripherals, or multiple serial interfaces.
  • Compact system integration  The 1136-FCBGA (35×35) surface-mount package supports board-level designs with space constraints while maintaining high resource counts.

Unique Advantages

  • High logic capacity: 52,224 logic elements enable complex implementations and larger state machines without external logic.
  • Substantial on-chip RAM: Approximately 4.9 Mbits of embedded memory reduces the need for external memory in many buffering and storage use cases.
  • Extensive I/O support: 480 I/O pins provide flexible connectivity for parallel and multi-channel systems, simplifying board routing for high-pin-count applications.
  • Compact BGA package: 1136-FCBGA (35×35) delivers high integration density in a surface-mount form factor suitable for modern PCB layouts.
  • Controlled core voltage range: 0.95 V to 1.05 V specification helps align power delivery design and regulator selection.
  • RoHS compliant: Meets environmental regulatory requirements for lead-free assemblies.

Why Choose XC5VSX50T-1FFG1136C?

The XC5VSX50T-1FFG1136C positions itself as a high-capacity, commercially graded FPGA option for designs that demand substantial programmable logic, significant embedded memory, and broad I/O. Its combination of 52,224 logic elements, approximately 4.9 Mbits of on-chip RAM, and 480 I/O pins supports a wide range of FPGA-based implementations while fitting into compact, surface-mount 1136-FCBGA footprints.

This part is appropriate for engineering teams and procurement looking for a commercially rated Virtex-5 SXT device with clearly specified electrical, thermal, and packaging parameters to aid design planning, power budgeting, and board integration.

Request a quote or submit an inquiry to sales to get pricing, availability, and ordering information for the XC5VSX50T-1FFG1136C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up