XC5VSX50T-1FFG665CES

IC FPGA 360 I/O 665FCBGA
Part Description

Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 360 4866048 52224 665-BBGA, FCBGA

Quantity 359 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package665-FCBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case665-BBGA, FCBGANumber of I/O360Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs4080Number of Logic Elements/Cells52224
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4866048

Overview of XC5VSX50T-1FFG665CES – Virtex®-5 SXT Field Programmable Gate Array

The XC5VSX50T-1FFG665CES is a Virtex‑5 SXT field programmable gate array supplied in a 665‑ball FCBGA package. It combines a high logic capacity, substantial on‑chip memory, and a large number of I/O to support complex, board‑mounted FPGA designs.

Designed for commercial applications, this surface‑mount FPGA operates from a 0.95 V to 1.05 V core supply and across a 0 °C to 85 °C operating range, making it suitable for a wide range of standard commercial electronic products.

Key Features

  • Logic Capacity 52,224 logic elements provide significant programmable logic resources for complex digital designs.
  • Embedded Memory Approximately 4.9 Mbits of on‑chip RAM to support data buffering, FIFOs, and on‑chip storage for state machines and processing tasks.
  • I/O Density 360 user I/O pins to accommodate multiple interfaces, peripherals, and parallel connections on a single device.
  • Package & Mounting 665‑BBGA FCBGA package (665‑FCBGA, 27×27) in a surface‑mount form factor for compact, high‑density PCB integration.
  • Power Core voltage requirement of 0.95 V to 1.05 V, enabling designs that use low‑voltage FPGA core domains.
  • Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
  • Environmental Compliance RoHS compliant to support lead‑free assembly and compliance with common environmental requirements.

Unique Advantages

  • High logic density: 52,224 logic elements enable implementation of large-scale digital functions within a single FPGA.
  • Substantial on‑chip RAM: Approximately 4.9 Mbits of embedded memory reduces reliance on external memory for many buffering and storage needs.
  • Extensive I/O capability: 360 I/O pins support multiple parallel interfaces and flexible board-level connectivity.
  • Compact, board‑ready package: 665‑FCBGA (27×27) surface‑mount package provides a dense footprint for space-constrained PCBs.
  • Commercial temperature suitability: Rated 0 °C to 85 °C for integration into a wide range of standard commercial products.
  • RoHS compliance: Supports lead‑free manufacturing practices and environmental requirements.

Why Choose XC5VSX50T-1FFG665CES?

The XC5VSX50T-1FFG665CES positions itself as a solid choice for commercial designs that require a balance of substantial programmable logic, embedded memory, and high I/O count in a compact FCBGA package. Its specifications—over 52k logic elements, approximately 4.9 Mbits of on‑chip RAM, and 360 I/Os—allow designers to consolidate functions and reduce external component count on the PCB.

With a low‑voltage core supply range and RoHS compliance, this device supports modern board design practices and assembly requirements while operating across the commercial temperature range expected in many consumer and professional electronics applications.

Request a quote or submit an inquiry to obtain pricing, availability, and additional procurement details for the XC5VSX50T-1FFG665CES.

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