XC5VSX95T-3FFG1136C
| Part Description |
Virtex®-5 SXT Field Programmable Gate Array (FPGA) IC 640 8994816 94208 1136-BBGA, FCBGA |
|---|---|
| Quantity | 1,898 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1136-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1136-BBGA, FCBGA | Number of I/O | 640 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 7360 | Number of Logic Elements/Cells | 94208 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 8994816 |
Overview of XC5VSX95T-3FFG1136C – Virtex®-5 SXT FPGA, 640 I/Os, 1136‑FCBGA
The XC5VSX95T-3FFG1136C is a Virtex‑5 SXT field programmable gate array (FPGA) IC designed for commercial-grade applications. It integrates a high-density logic fabric with substantial on-chip memory and a large I/O count to address designs that require significant programmable logic and embedded RAM.
This device is optimized for use in commercial designs that require large logic capacity, abundant I/O, and precise supply and temperature operating ranges as specified.
Key Features
- Core & Logic Fabric 7,360 CLBs delivering 94,208 logic elements, providing a high logic density for complex digital implementations.
- Embedded Memory Approximately 8.99 Mbits of on‑chip RAM to support data buffering, state storage, and memory‑intensive logic functions.
- I/O Capability 640 user I/Os to support extensive peripheral and board-level interfacing without external expander logic.
- Package & Mounting 1136‑FCBGA package (1136‑BBGA variant noted) with supplier device package listed as 1136‑FCBGA (35×35); surface‑mount device ideal for standard PCB assembly.
- Power Requirements Core voltage supply range specified from 950 mV to 1.05 V for predictable power planning and system design.
- Operating Range Commercial operating temperature from 0 °C to 85 °C to match typical commercial electronics environments.
- Environmental Compliance RoHS‑compliant, meeting common environmental regulation requirements for commercial products.
Typical Applications
- High‑density digital processing — Deploy the device where large numbers of logic elements and CLBs are needed to implement complex algorithms and custom logic.
- Memory‑intensive functions — Use the embedded RAM for buffering, packet processing, or temporary data storage within the FPGA fabric.
- Extensive I/O interfacing — Leverage 640 I/Os for designs requiring multiple parallel interfaces, external peripherals, or board‑level connectivity.
- Commercial electronic systems — Suited to commercial‑grade products that operate within the supplied temperature and voltage ranges.
Unique Advantages
- High logic density: 94,208 logic elements (with 7,360 CLBs) enable consolidation of complex functions into a single programmable device, reducing BOM count.
- Substantial on‑chip RAM: Approximately 8.99 Mbits of embedded memory supports local data storage and high‑throughput buffering without external memory.
- Large I/O footprint: 640 I/Os allow direct interfacing to numerous peripherals and signals, simplifying board design and reducing external interface components.
- Defined power envelope: Core voltage range of 950 mV to 1.05 V provides clear parameters for power supply design and system integration.
- Commercial temperature rating: Rated for 0 °C to 85 °C to match typical commercial product requirements and deployment scenarios.
- RoHS compliant: Conforms to common environmental regulations for commercial electronics manufacturing.
Why Choose XC5VSX95T-3FFG1136C?
The XC5VSX95T-3FFG1136C positions itself as a high‑capacity, commercially rated FPGA that combines a large logic fabric, significant embedded RAM, and an extensive I/O complement in a single 1136‑FCBGA surface‑mount package. It is appropriate for design teams seeking to implement dense programmable logic and onboard memory while maintaining clear power and thermal operating boundaries.
This part is well suited to commercial electronic designs that benefit from scalability within the Virtex‑5 SXT family, enabling consolidation of functions, streamlined board routing, and predictable supply‑chain and environmental conformity for production deployments.
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