XC5VTX240T-1FF1759CES

IC FPGA 680 I/O 1759FCBGA
Part Description

Virtex®-5 TXT Field Programmable Gate Array (FPGA) IC 680 11943936 239616 1759-BBGA, FCBGA

Quantity 635 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1759-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1759-BBGA, FCBGANumber of I/O680Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs18720Number of Logic Elements/Cells239616
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11943936

Overview of XC5VTX240T-1FF1759CES – Virtex®-5 TXT FPGA, 680 I/Os, 1759-FCBGA

The XC5VTX240T-1FF1759CES is a Virtex®-5 TXT Field Programmable Gate Array (FPGA) in a 1759-FCBGA package. It combines high logic capacity with substantial on-chip memory and a large I/O count to support complex, reconfigurable digital designs.

Designed for commercial-grade applications, this device offers 239,616 logic elements and approximately 11.94 Mbits of embedded memory, along with a wide supply voltage range and surface-mount packaging for system-level integration.

Key Features

  • Core Logic: 239,616 logic elements provide extensive programmable resources for complex digital implementations.
  • Embedded Memory: Approximately 11.94 Mbits of on-chip RAM to support buffering, lookup tables, and intermediate storage.
  • I/O Capacity: 680 user I/O pins to handle extensive interfacing and parallel connectivity needs.
  • Package: 1759-BBGA, FCBGA package (Supplier device package: 1759-FCBGA (42.5x42.5)), optimized for high-density board mounting.
  • Power: Core voltage supply range of 950 mV to 1.05 V to match system power-rail requirements.
  • Thermal/Grade: Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
  • Mounting: Surface mount device suitable for modern PCB assembly workflows.
  • Environmental Compliance: RoHS compliant for regulatory and assembly compatibility.

Typical Applications

  • Reconfigurable digital systems: High logic density and on-chip memory enable adaptable hardware implementations and iterative design changes.
  • High‑pin-count interface bridging: 680 I/Os support extensive parallel and multi‑lane connectivity between subsystems and peripherals.
  • Memory‑centric logic: Nearly 12 Mbits of embedded RAM supports data buffering, packet processing, and intermediate storage within logic pipelines.
  • System prototyping and integration: Surface-mount 1759-FCBGA packaging facilitates integration into prototype and production PCBs for complex system development.

Unique Advantages

  • Extensive programmable capacity: 239,616 logic elements give designers room to implement large, multi-function logic designs without immediate up-scaling.
  • Substantial on-chip memory: Approximately 11.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
  • High I/O flexibility: 680 I/O pins enable dense peripheral and subsystem interconnects, minimizing the need for external bridging components.
  • Compact, production-ready package: 1759-FCBGA (42.5x42.5) surface-mount package supports high-density PCB layouts and automated assembly.
  • Power compatibility: Core supply range of 950 mV to 1.05 V aligns with common FPGA power architectures for efficient integration.
  • Regulatory readiness: RoHS compliance facilitates easier qualification for mainstream commercial products.

Why Choose XC5VTX240T-1FF1759CES?

The XC5VTX240T-1FF1759CES positions itself as a high-capacity, commercial-grade Virtex®-5 TXT FPGA suitable for designs that require large programmable logic resources, significant embedded memory, and a high I/O count in a compact FCBGA package. Its combination of logic elements, on-chip RAM, and 680 I/Os supports complex interfacing and integration needs while fitting standard surface-mount assembly flows.

For teams developing dense digital systems, prototypes requiring rapid iteration, or products that demand extensive on-chip resources without external memory proliferation, this device offers a balanced mix of capacity, package density, and compliance to streamline design and production planning.

Request a quote or submit an inquiry to receive pricing, availability, and purchasing information for the XC5VTX240T-1FF1759CES.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up