XC5VTX240T-2FFG1759C

The XC5VTX240T-2FFG1759C is an AMD Virtex‑5 TXT field programmable gate array supplied in a 1759‑ball FCBGA package. It provides high logic capacity, extensive on‑chip memory, and a large number of I/O pins for commercial embedded system designs.

With 18,720 configurable logic blocks and 239,616 logic cells, approximately 11.94 Mbits of embedded RAM, and 680 I/O, this device targets applications that require dense logic integration, substantial embedded memory, and wide external interfacing within a surface‑mount FCBGA form factor.

Key Features

• Core Logic 18,720 CLBs and 239,616 logic cells provide high-density programmable logic resources for complex design implementations.
• Embedded Memory Approximately 11.94 Mbits of on‑chip RAM to support data buffering, LUT storage, and intermediate processing without relying solely on external memory.
• I/O Capability 680 user I/O pins to accommodate extensive external interfacing, parallel buses, and multi‑channel connections.
• Package 1759‑BBGA FCBGA package (supplier package: 1759‑FCBGA, 42.5 × 42.5 mm) optimized for compact, surface‑mount board designs.
• Power Core voltage supply range of 0.95 V to 1.05 V to match system power rails and design requirements.
• Commercial Grade and Temperature Rated for commercial operation with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliant Device conforms to RoHS requirements for restricted substances.

Typical Applications

• High‑density digital processing Implement complex logic functions and custom datapaths using the device’s large CLB and logic‑cell resources.
• Memory‑intensive embedded systems Use the roughly 11.94 Mbits of on‑chip RAM for buffering, look‑up tables, and intermediate storage to reduce external memory dependency.
• I/O‑heavy interfaces Support designs requiring many external connections—parallel sensors, data buses, or multi‑channel peripherals—through 680 I/O pins.
• Compact surface‑mount designs Deploy in space‑constrained commercial products using the 1759‑ball FCBGA package (42.5 × 42.5 mm).

Unique Advantages

• High programmable logic capacity: Large CLB and logic‑cell counts enable implementation of sizeable, integrated digital systems on a single FPGA.
• Substantial embedded memory: Approximately 11.94 Mbits of on‑chip RAM supports local buffering and reduces the need for frequent external memory accesses.
• Extensive I/O provisioning: 680 I/Os provide flexibility for connecting multiple interfaces, sensors, or parallel data streams without complex multiplexing.
• Compact, manufacturable package: 1759‑ball FCBGA in a 42.5 × 42.5 mm footprint suits modern surface‑mount assembly processes and dense PCB layouts.
• Controlled power range: Defined core supply between 0.95 V and 1.05 V allows straightforward integration with regulated power domains.
• Commercial rating and compliance: Designed for commercial temperature ranges (0 °C to 85 °C) and RoHS compliance for regulatory alignment.

Why Choose XC5VTX240T-2FFG1759C?

The XC5VTX240T-2FFG1759C combines high logic density, significant embedded RAM, and a large I/O count in a single Virtex‑5 TXT FCBGA package from AMD. This combination makes it well suited for commercial designs that demand integrated logic capacity, on‑chip memory, and broad external connectivity within a compact surface‑mount form factor.

For development teams and procurement focused on scalable, high‑capacity FPGA solutions, this device offers a balance of programmable resources, package density, and commercial‑grade operating parameters that support medium‑ to high‑complexity embedded systems.

Request a quote or submit an inquiry to receive pricing and availability information for the XC5VTX240T-2FFG1759C.