XC6SLX100-2FG484I

The XC6SLX100-2FG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD designed for industrial applications. It provides a programmable logic fabric with significant on-chip memory and flexible I/O capability to support a wide range of embedded and control-oriented designs.

With approximately 101,261 logic elements, roughly 4.94 Mbits of embedded memory, and 326 I/O pins in a 484-BBGA surface-mount package, this device targets designs requiring substantial logic capacity, plentiful I/O, and industrial temperature operation.

Key Features

• Core Logic  Approximately 101,261 logic elements for implementing custom digital logic and state machines.
• Configurable Logic Blocks (CLBs)  7,911 CLBs to structure the device's programmable fabric for a variety of logic partitioning and routing strategies.
• On-Chip Memory  Approximately 4.94 Mbits of embedded RAM to support buffering, packet processing, and local data storage.
• I/O Capacity  326 general-purpose I/O pins to interface with multiple peripherals, sensors, and external devices.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and enable stable core operation.
• Package & Mounting  484-BBGA package (supplier package 484-FBGA, 23×23) designed for surface-mount assembly.
• Temperature Range & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance  RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• Industrial Control Systems  Implement custom control logic, I/O aggregation, and deterministic processing within the industrial temperature range supported by the device.
• Embedded Data Processing  Use the combination of logic elements and embedded RAM for local data buffering, protocol handling, and deterministic processing tasks.
• I/O Expansion and Interface Bridging  Leverage 326 I/O pins to consolidate and bridge multiple peripheral interfaces and sensor inputs in compact system designs.

Unique Advantages

• Substantial Logic Density:  Approximately 101,261 logic elements enable complex custom logic implementations without external ASICs or discrete glue logic.
• Ample On-Chip Memory:  Roughly 4.94 Mbits of embedded RAM support buffering, FIFOs, and temporary data storage directly on the FPGA fabric.
• High I/O Count:  326 I/O pins simplify integration with multiple peripherals and reduce the need for additional interface chips.
• Industrial Temperature Capability:  Rated for −40 °C to 100 °C operation, supporting designs deployed in harsh or temperature-variable environments.
• Surface-Mount, High-Density Package:  484-BBGA (484-FBGA, 23×23) provides a compact footprint for high-density PCB designs.
• Regulatory and Assembly-Friendly:  RoHS compliant and available in a standard surface-mount package suitable for modern assembly flows.

Why Choose XC6SLX100-2FG484I?

The XC6SLX100-2FG484I offers a balance of logic capacity, embedded memory, and abundant I/O in an industrial-grade FPGA package. Its specification set supports designs that require on-device buffering and extensive peripheral interfacing while operating across a wide temperature range.

This device is suitable for engineering teams and procurement looking for a programmable, RoHS-compliant FPGA solution that integrates substantial logic resources and I/O density into a compact surface-mount 484-BBGA package.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC6SLX100-2FG484I.