XC6SLX100-2FGG484I

The XC6SLX100-2FGG484I is a Spartan®-6 LX field programmable gate array (FPGA) packaged in a 484-BBGA footprint. This device provides a high-density programmable fabric with substantial on-chip memory and a large number of I/O pins for complex digital designs.

With 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and 326 I/Os, the device is designed for applications that require significant logic capacity, extensive connectivity, and operation across an industrial temperature range.

Key Features

• Core Capacity — 101,261 logic elements to implement complex custom logic and parallel processing functions.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• I/O Count — 326 I/Os for broad interfacing options with peripherals, sensors, and external subsystems.
• Package and Mounting — 484-BBGA package case with supplier device package specified as 484-FBGA (23×23); surface-mount device for compact board-level integration.
• Power — Core supply range of 1.14 V to 1.26 V, suitable for designs targeting this voltage domain.
• Industrial Temperature — Rated for operation from −40 °C to 100 °C for deployment in environments requiring extended temperature tolerance.
• Compliance — RoHS compliant, meeting common lead-free manufacturing requirements.

Typical Applications

• High-density logic designs — Implement large-scale custom logic functions using the device's 101,261 logic elements and flexible fabric.
• On-chip buffering and control — Leverage approximately 4.94 Mbits of embedded memory for data buffering, FIFOs, and local storage without immediate need for external RAM.
• Multi-I/O interfacing — Utilize 326 I/Os to connect to a wide set of peripherals, sensors, and digital interfaces on complex boards.

Unique Advantages

• High logic density: 101,261 logic elements enable implementation of sizable custom logic and parallel datapaths, reducing the need for multiple discrete FPGAs.
• Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM helps minimize external memory requirements and simplifies board design.
• Extensive connectivity: 326 I/Os offer flexible routing and interfacing options to support complex system topologies.
• Industrial temperature tolerance: −40 °C to 100 °C rating supports deployment in temperature-challenged environments.
• Compact BGA package: 484-BBGA / 484-FBGA (23×23) package delivers high pin count in a compact surface-mount form factor for space-constrained PCBs.
• RoHS compliant: Meets lead-free manufacturing requirements for compliant production processes.

Why Choose XC6SLX100-2FGG484I?

The XC6SLX100-2FGG484I positions itself as a high-capacity Spartan®-6 LX FPGA option for designers needing a balance of logic resources, embedded memory, and a large I/O budget within a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for products requiring rated environmental performance and lead-free manufacturing compatibility.

This device is appropriate for engineering teams building complex digital systems that benefit from on-chip memory, extensive I/O, and significant programmable logic—all backed by AMD's Spartan®-6 family heritage and available technical documentation.

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