XC6SLX100-3CSG484I

The XC6SLX100-3CSG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD, engineered as a programmable logic device for implementing custom digital functions. It delivers substantial on-chip resources—101,261 logic elements and approximately 4.94 Mbits of embedded memory—together with 338 I/O pins in a compact 484-CSPBGA (19×19) package.

Specified for industrial use, the device operates over a -40 °C to 100 °C temperature range and accepts a core supply voltage between 1.14 V and 1.26 V, making it suitable for industrial embedded designs that require high logic capacity, significant on-chip memory, and extensive I/O in a surface-mount BGA footprint.

Key Features

• Core Logic Capacity  101,261 logic elements provide a large programmable fabric for implementing custom digital functions and complex combinational/sequential logic.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM support buffering, temporary data storage, and memory-intensive logic functions.
• High-Density I/O  338 user I/O pins enable broad external interfacing for control, data acquisition, and peripheral connectivity.
• Package and Mounting  Supplied in a 484-CSPBGA (19×19) package (package case: 484-FBGA, CSPBGA) for surface-mount board integration in compact designs.
• Power  Core supply voltage range of 1.14 V to 1.26 V for the FPGA fabric.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet industrial-environment requirements.
• Compliance  RoHS compliant for environmental regulatory adherence.

Typical Applications

• Industrial Embedded Systems  Industrial-grade operation and robust logic capacity make this FPGA suitable for implementation of control logic and custom processing in industrial equipment.
• High-Density I/O Control  With 338 I/O pins, the device supports complex interfacing tasks such as sensor aggregation, actuator control, and multi-channel I/O management.
• Memory-Intensive Logic Functions  Approximately 4.94 Mbits of embedded RAM enable on-chip buffering and data handling for applications that require significant temporary storage.
• Custom Digital and Prototyping Designs  Large logic element count provides headroom for developing and validating custom digital architectures and feature-rich prototypes.

Unique Advantages

• High Logic Density: 101,261 logic elements allow implementation of complex custom logic and parallel processing structures on a single device.
• Substantial On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduce reliance on external memory for many buffering and temporary storage needs.
• Extensive I/O Capability: 338 I/O pins support wide-ranging external connectivity, minimizing the need for additional interface components.
• Industrial Operating Range: Rated from -40 °C to 100 °C to support deployment in harsh or tightly controlled industrial environments.
• Compact BGA Package: 484-CSPBGA (19×19) footprint offers a space-efficient solution for high-density PCB designs using surface-mount assembly.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing compliance requirements.

Why Choose XC6SLX100-3CSG484I?

The XC6SLX100-3CSG484I balances high logic capacity, significant on-chip memory, and extensive I/O in a compact industrial-grade package. Its combination of 101,261 logic elements, approximately 4.94 Mbits of embedded RAM, and 338 I/O pins makes it well suited to embedded applications that require programmable, high-density digital resources within a surface-mount BGA footprint.

Designed for industrial environments and supplied by AMD as part of the Spartan®-6 LX family, this FPGA is appropriate for engineers and procurement teams seeking a reliable, high-capacity programmable device for industrial embedded designs that demand on-chip integration and a wide operating temperature range.

Request a quote or submit a purchase inquiry to obtain pricing and availability for the XC6SLX100-3CSG484I.