XC6SLX100-3FG484C

The XC6SLX100-3FG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD. It provides programmable logic with approximately 101,261 logic elements, approximately 4.94 Mbits of embedded memory and up to 326 user I/Os.

Packaged in a 484-BBGA (supplier device package: 484-FBGA, 23×23) surface-mount package, this commercial-grade FPGA operates from 1.14 V to 1.26 V and across a 0 °C to 85 °C temperature range, offering integration and I/O density for a wide range of commercial embedded designs.

Key Features

• Core Logic  Approximately 101,261 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM (4,939,776 total RAM bits) to support buffering, lookup tables and local storage without immediate need for external memory.
• I/O Density  326 user I/Os to support multiple external interfaces and parallel connections directly from the FPGA.
• Package and Mounting  484-BBGA package (supplier package: 484-FBGA, 23×23) with surface-mount mounting for compact, high-pin-count board designs.
• Power  Supported supply voltage range from 1.14 V to 1.26 V to enable predictable power budgeting in system designs.
• Operating Temperature  Commercial temperature rating from 0 °C to 85 °C for mainstream commercial applications.
• Compliance  RoHS compliant.

Typical Applications

• Commercial Embedded Systems  Programmable logic, control functions and integration in commercial electronic products that require moderate temperature range and RoHS compliance.
• I/O-Intensive Interface Bridging  High I/O count enables aggregation and routing of multiple peripherals and buses within a single device.
• Prototyping and Production Builds  Surface-mount 484-BBGA package and commercial-grade specifications make the device suitable for both development prototypes and production units in commercial designs.

Unique Advantages

• High Logic Capacity: Approximately 101,261 logic elements allow consolidation of complex functions onto a single FPGA, reducing board-level component count.
• Significant On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O Count: 326 user I/Os simplify system-level connectivity and lower the need for external interface chips.
• Compact, High-Pin-Count Package: 484-BBGA (23×23) provides dense routing capability in a surface-mount footprint suitable for space-constrained boards.
• Predictable Power Envelope: Narrow supply voltage range (1.14 V–1.26 V) helps with straightforward power supply design and budgeting.
• Commercial-Grade Compliance: 0 °C–85 °C operating range and RoHS compliance support mainstream commercial deployments.

Why Choose XC6SLX100-3FG484C?

The XC6SLX100-3FG484C combines substantial logic capacity, on-chip memory and a high I/O count in a compact 484-BBGA surface-mount package, making it a practical choice for commercial embedded designs that require significant programmable logic and interface density. Its commercial operating range and RoHS compliance align with mainstream production requirements.

This FPGA is suited to teams and projects that need to consolidate complex logic, manage multiple external interfaces, and maintain a compact board footprint while operating within a commercial temperature window. The combination of specified logic elements, embedded memory and I/O simplifies system architecture and can reduce overall bill of materials for targeted applications.

Request a quote or submit an inquiry to check pricing and availability for the XC6SLX100-3FG484C and discuss how it can fit your next commercial FPGA design.