XC6SLX100-3FG676I

The XC6SLX100-3FG676I is an AMD Spartan®-6 LX Field Programmable Gate Array (FPGA) supplied in a 676-ball BGA package. It provides a high-density programmable logic resource suitable for industrial-grade embedded designs that require substantial logic capacity, on-chip memory, and a large number of I/O connections.

With 101,261 logic elements and approximately 4.94 Mbits of embedded memory, this device is targeted at applications that need configurable digital logic, significant internal RAM, and extensive external interfacing within a surface-mount BGA form factor.

Key Features

• Logic Capacity  101,261 logic elements to implement complex custom digital logic and control functions.
• Configurable Logic Blocks  7,911 configurable logic resources (reported CLB count) to organize and scale logic implementations across the device.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for buffering, frame storage, and data path implementations without external memory.
• I/O Density  480 user I/O pins to support wide parallel interfaces, multi-channel sensor or actuator connections, and rich peripheral connectivity.
• Power Supply  Specified core voltage range of 1.14 V to 1.26 V for compatibility with targeted FPGA core power rails.
• Package & Mounting  676-ball BGA package (27 × 27 mm) designed for surface-mount assembly to support compact, high-density board layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant  Manufactured in compliance with RoHS environmental requirements.

Typical Applications

• Industrial Control  Implement machine control logic, digital I/O aggregation, and protocol bridging in industrial automation systems using the device’s industrial temperature rating and extensive I/O.
• Embedded Data Processing  Use on-chip RAM and abundant logic elements for buffering, custom data pipelines, and real-time processing tasks in embedded platforms.
• High-Density I/O Systems  Leverage 480 I/O pins for multi-channel sensor interfaces, parallel imaging front ends, or dense communication I/O requirements.

Unique Advantages

• Substantial Logic Resources: 101,261 logic elements allow large or highly parallel designs to be implemented on a single device, reducing system complexity.
• Significant On-Chip Memory: Approximately 4.94 Mbits of embedded RAM minimizes dependence on external memory for many buffering and storage tasks.
• High I/O Count: 480 user I/O pins provide flexible connectivity for complex peripheral and sensor arrays without additional I/O expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to meet demanding environmental conditions commonly found in industrial applications.
• Compact BGA Packaging: 676-ball BGA (27 × 27) enables high-density PCB integration while supporting surface-mount manufacturing processes.
• RoHS Compliance: Conforms to RoHS requirements to support environmentally responsible manufacturing and deployment.

Why Choose XC6SLX100-3FG676I?

The XC6SLX100-3FG676I positions itself as a high-capacity, industrial-grade FPGA option for designers who require a combination of extensive logic resources, sizable embedded memory, and a large number of I/O in a compact BGA package. Its specified core voltage range and industrial temperature rating make it suitable for robust embedded systems where reliability and board-level integration density matter.

This device is well suited for engineering teams implementing complex data paths, multi-channel interfaces, or industrial control logic that benefit from on-chip memory and a high pin count. The combination of programmable logic capacity and packaging options supports scalability and long-term deployment in production environments.

Request a quote or submit a pricing inquiry to evaluate the XC6SLX100-3FG676I for your next design or production run.