XC6SLX100-3FGG676C

The XC6SLX100-3FGG676C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD. It provides a programmable logic platform with a substantial number of logic elements and embedded RAM for commercial electronic designs.

Designed for commercial-grade applications, this device targets systems that require a balance of logic capacity, on-chip memory, and a high I/O count in a compact 676-ball BGA package.

Key Features

• Logic Capacity  Approximately 101,261 logic elements for implementing complex digital functions and custom logic blocks.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM (4,939,776 total RAM bits) to support buffers, FIFOs and data storage close to logic.
• I/O Density  480 I/O pins to support multiple interfaces, peripherals and external connections in a single device.
• Package & Mounting  676-BGA package (supplier package: 676-FBGA, 27×27) in a surface-mount form factor for compact board layouts.
• Power  Core supply range of 1.14 V to 1.26 V to match platform power requirements and system design constraints.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C and compliant with RoHS environmental standards.

Typical Applications

• Commercial Embedded Systems  Used to implement custom control logic and data handling functions in commercial electronic products.
• Communications Equipment  Suitable for building protocol-specific interfaces and parallel I/O stages where high pin count and on-chip memory are required.
• Prototyping and Development  A platform for validating digital designs that require substantial logic capacity and memory resources within a commercial temperature range.

Unique Advantages

• High Logic Density:  About 101,261 logic elements enable complex finite-state machines, datapath logic and custom accelerators without immediately resorting to larger devices.
• Significant On-Chip Memory:  Approximately 4.94 Mbits of embedded RAM reduces external memory dependence for many buffering and storage needs.
• Extensive I/O Resources:  480 I/O pins provide flexibility for connecting multiple peripherals, buses and interfaces from a single FPGA.
• Compact BGA Package:  676-BGA (27×27) offers a dense, surface-mount footprint that helps minimize PCB area for space-constrained designs.
• Commercial Operating Range:  Rated 0 °C to 85 °C for deployments in standard commercial environments.
• RoHS Compliant:  Meets environmental compliance requirements for lead-free manufacturing processes.

Why Choose XC6SLX100-3FGG676C?

The XC6SLX100-3FGG676C packs a strong combination of logic capacity, on-chip RAM and high I/O count in a commercially graded, RoHS-compliant 676-BGA package. It is positioned for designers who need substantial programmable resources and versatile I/O in a compact surface-mount form factor for commercial electronic products.

This FPGA is well suited to teams building scalable digital designs that require integrated memory and extensive connectivity while operating within standard commercial temperature limits. Its clear electrical and mechanical specifications make it straightforward to evaluate for board-level integration.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX100-3FGG676C for your next design.