XC6SLX100-3FG676C

The XC6SLX100-3FG676C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD, delivered in a 676-ball BGA package. It combines a high count of configurable logic resources, on-chip embedded RAM, and a large I/O complement to support complex programmable logic designs.

This commercial-grade FPGA is suitable for designs that require substantial logic capacity, significant embedded memory, and broad I/O integration while operating within standard commercial temperature and supply ranges.

Key Features

• Core Logic 7,911 configurable logic blocks (CLBs) and approximately 101,261 logic elements provide the programmable fabric for implementing complex digital functions.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, lookup tables, and state storage for memory-intensive logic.
• I/O Capacity 480 general-purpose I/O pins to interface with peripherals, buses, and external devices at the board level.
• Package & Mounting 676-ball BGA package (supplier package: 676-FBGA, 27×27) with surface-mount mounting for board-level integration.
• Power Supply Core supply voltage range from 1.14 V to 1.26 V to match system power budgets and regulator designs.
• Operating Range & Grade Commercial temperature range from 0 °C to 85 °C; classified as Commercial grade.
• Regulatory Compliance RoHS compliant for environmentally conscious designs and global manufacturing requirements.

Typical Applications

• High-density digital processing — Implement complex logic functions and data path processing using the large pool of logic elements and CLBs.
• Memory-centric designs — Leverage approximately 4.94 Mbits of embedded RAM for buffering, packet storage, and LUT-based functions.
• Board-level I/O aggregation — Use the 480 I/O pins to consolidate multiple peripheral interfaces or high-pin-count sensor and bus connections.

Unique Advantages

• Substantial programmable fabric: A high count of CLBs and logic elements enables implementation of sizeable custom logic without external ASICs.
• On-chip memory footprint: Nearly 5 Mbits of embedded RAM reduces dependence on external memory for many buffering and LUT needs.
• Broad I/O integration: 480 I/O pins simplify board routing and allow integration of multiple interfaces directly to the FPGA.
• Compact, standardized packaging: 676-BGA / 676-FBGA (27×27) supports dense board layouts and surface-mount assembly processes.
• Commercial temperature and RoHS compliance: Clear operating range and environmental compliance support mainstream manufacturing and deployment.

Why Choose XC6SLX100-3FG676C?

The XC6SLX100-3FG676C positions itself as a capable, commercially graded Spartan®-6 LX FPGA for designers who need a balance of large logic capacity, significant on-chip RAM, and expansive I/O in a compact BGA footprint. Its specified core voltage range and RoHS compliance make it straightforward to integrate into standard commercial system designs.

This device is well suited to teams developing board-level programmable logic solutions that require scalability in logic and memory without moving to external ASICs or additional memory components, offering a clear path for medium- to high-complexity FPGA implementations.

Request a quote or submit an inquiry to purchase the XC6SLX100-3FG676C and to discuss pricing and availability for your design needs.