XC6SLX100-3FG484I

The XC6SLX100-3FG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC from AMD. It provides a high-density, configurable hardware fabric combining approximately 101,261 logic elements with embedded memory and a large I/O count for system integration.

Packaged in a 484-ball BGA and specified for industrial operation, this device is suited for designs that require significant on-chip logic capacity, abundant I/O, and operation across a wide temperature range.

Key Features

• Logic Capacity  Approximately 101,261 logic elements enabling complex, custom digital logic implementations.
• Configurable Logic Blocks  7,911 CLBs (configurable logic blocks) to structure and partition logic functions efficiently.
• Embedded Memory  Approximately 4.94 Mbits of embedded RAM for buffering, FIFOs, and storage of intermediate data paths.
• I/O Resources  326 I/O pins to support broad external interface requirements and parallel connectivity.
• Power Supply  Core voltage support from 1.14 V to 1.26 V for the device core supply domain.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount PCB assembly.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, suitable for industrial environments.
• RoHS Compliant  Meets RoHS requirements for lead-free manufacturing processes.

Typical Applications

• Industrial Control  Leverages industrial temperature rating and extensive I/O count for machine control, motor drivers, and automation interfaces.
• Data Buffering and Processing  Uses the approximately 4.94 Mbits of on-chip RAM and large logic resource pool to implement data paths, buffering, and protocol handling.
• High-Density Logic Integration  Employs the device’s ~101,261 logic elements to consolidate multiple digital functions into a single FPGA package, reducing board-level component count.

Unique Advantages

• High Logic Density: The large logic element count supports complex state machines, custom accelerators, and parallel processing within a single device.
• Substantial Embedded Memory: Nearly 5 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage requirements.
• Extensive I/O Connectivity: 326 I/Os enable flexible interfacing to sensors, peripherals, and parallel buses without excessive external multiplexing.
• Industrial-Grade Operation: Specified -40 °C to 100 °C operation supports deployment in temperature-demanding applications.
• Compact BGA Packaging: The 484-ball BGA (23×23) provides a balance of pin count and PCB footprint for space-constrained designs.
• RoHS Compliance: Supports modern manufacturing requirements for lead-free assembly.

Why Choose XC6SLX100-3FG484I?

The XC6SLX100-3FG484I positions itself as a robust, industrial-grade Spartan®-6 LX FPGA that combines a high logic element count, several megabits of embedded RAM, and a large number of I/Os in a 484-ball BGA package. These attributes make it well suited for designs that require dense logic integration, substantial on-chip memory, and broad external connectivity.

For engineers and procurement teams targeting industrial applications that demand dependable temperature performance and high integration, this FPGA offers a balanced solution that consolidates functionality, reduces board complexity, and aligns with RoHS manufacturing practices.

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