XC6SLX100-3CSG484C

The XC6SLX100-3CSG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) from AMD designed for commercial embedded and logic-intensive applications. It combines a high logic element count and substantial on-chip memory with a compact 484‑FBGA package to support dense, custom digital designs.

With a supply voltage range of 1.14 V to 1.26 V and a commercial operating temperature range of 0 °C to 85 °C, this surface-mount FPGA is suited for a wide range of commercial electronics where programmable logic, flexible I/O and board-level integration are required.

Key Features

• Logic Capacity Provides 101,261 logic elements for implementing complex custom logic, state machines and processing pipelines.
• Embedded Memory Includes approximately 4.94 Mbits of on-chip RAM to support buffers, FIFOs and local data storage.
• I/O Density Offers 338 user I/O pins to connect to multiple peripherals, buses and external devices while supporting high pin-count designs.
• Package & Mounting Supplied in a 484‑FBGA (484‑CSPBGA, 19×19) package for a compact board footprint and surface-mount assembly.
• Power Designed for a core supply voltage between 1.14 V and 1.26 V to match system power rails and support predictable power budgeting.
• Temperature & Grade Commercial-grade device rated for operation from 0 °C to 85 °C, suitable for commercial electronic products.
• Environmental Compliance RoHS compliant to support regulatory and manufacturing requirements for lead-free assembly.

Typical Applications

• Commercial Embedded Systems — Implement custom logic, protocol conversion and peripheral control in commercial products and appliances.
• Prototyping and Development — Use as a programmable platform for validating digital designs and iterating hardware architectures.
• High‑Density I/O Control — Manage multiple interfaces and parallel signals where a large number of user I/Os is required.
• Custom Digital Processing — Implement application-specific processing blocks that benefit from substantial logic resources and on-chip RAM.

Unique Advantages

• High Logic Integration: 101,261 logic elements enable implementation of large and complex designs without external ASICs.
• Substantial On‑Chip Memory: Approximately 4.94 Mbits of embedded RAM reduce dependence on external memory for buffering and local storage.
• Large I/O Count: 338 user I/Os support multiple peripherals, parallel interfaces and dense connector schemes.
• Compact BGA Footprint: 484‑FBGA package provides high integration in a space-efficient surface-mount form factor.
• Commercial Temperature Range: Rated 0 °C to 85 °C to meet typical commercial product environmental requirements.
• RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose XC6SLX100-3CSG484C?

The XC6SLX100-3CSG484C delivers a balanced combination of logic capacity, on-chip memory and I/O density in a compact 484‑FBGA package, making it a practical choice for commercial designs that require flexible, programmable logic. Its specification set supports integration of complex digital functions while simplifying board-level layout through a high pin count and surface-mount package.

Designed and manufactured by AMD as part of the Spartan‑6 LX family, this FPGA is well suited to developers and teams building scalable commercial products, prototypes and custom logic solutions where predictable electrical and environmental characteristics are important.

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