XC6SLX100-2FGG676C

The XC6SLX100-2FGG676C is a Spartan®-6 LX field programmable gate array (FPGA) offered in a 676-ball BGA package. It provides a high count of programmable logic resources, embedded memory, and a large I/O complement for compact, surface-mount digital designs.

Designed for commercial temperature operation, the device targets applications that require substantial on-chip logic and memory capacity while maintaining a compact 27 × 27 mm FBGA footprint and RoHS compliance.

Key Features

• Logic Capacity  Approximately 101,261 logic elements and 7,911 configurable logic blocks (CLBs) to implement custom digital functions and control logic.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for buffering, state storage, and small lookup tables.
• I/O Density  480 available I/O pins to support wide interfaces, parallel buses, and mixed-signal board-level connectivity needs.
• Package and Mounting  676-ball FBGA (27 × 27 mm) surface-mount package (676-BGA) for space-efficient board integration.
• Power Supply  Core voltage supply range of 1.14 V to 1.26 V to match required power rail specifications.
• Operating Range  Commercial-grade operation from 0 °C to 85 °C for standard embedded and consumer applications.
• Compliance  RoHS-compliant device suitable for lead-free assembly processes.

Typical Applications

• Custom digital processing  Implement algorithm acceleration and tailored datapaths using the device’s large pool of logic elements and embedded RAM.
• I/O-intensive interfaces  Leverage 480 I/O pins to connect to parallel sensors, memory banks, and wide buses in compact systems.
• Embedded control and state machines  Use abundant CLBs and embedded memory to implement control logic, finite state machines, and protocol handlers.
• Compact board-level integration  The 676-FBGA (27 × 27) surface-mount package enables high-density designs where PCB area is constrained.

Unique Advantages

• High logic integration: With approximately 101,261 logic elements, the device supports complex custom logic without external FPGA expansion.
• Substantial embedded memory: Nearly 4.94 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs.
• Extensive I/O availability: 480 I/O pins allow flexible interfacing and support for parallel and high-pin-count peripherals.
• Compact BGA package: The 676-ball FBGA in a 27 × 27 mm footprint enables dense, surface-mount implementations on modern PCBs.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS-compliant for lead-free manufacturing processes.

Why Choose XC6SLX100-2FGG676C?

The XC6SLX100-2FGG676C combines a large complement of logic elements, significant embedded memory, and high I/O density in a compact 676-BGA surface-mount package, making it well suited to commercial embedded designs that require substantial on-chip resources. Its voltage and temperature specifications align with standard commercial power and thermal environments.

For teams focused on reducing external components while maintaining flexibility, this FPGA offers a balanced mix of integration, I/O capability, and manufacturability backed by RoHS compliance.

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