XC6SLX100-2FG676C

The XC6SLX100-2FG676C is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD. It delivers substantial on-chip logic and memory resources in a compact 676-ball BGA package for board-level integration.

Key on-chip resources include approximately 101,261 logic elements, roughly 4.94 Mbits of embedded RAM, and up to 480 I/Os. The device is a commercial-grade, surface-mount FPGA with a core supply range of 1.14 V to 1.26 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 101,261 logic elements for implementing programmable digital logic and custom hardware functions.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, look-up tables, and small data stores without external memory.
• I/O Capacity  Up to 480 general-purpose I/O pins to interface with peripherals, sensors, and external devices at board level.
• Package  676-ball BGA (supplier package: 676-FBGA, 27 × 27 mm) for high-density mounting and robust board integration.
• Power  Core supply voltage range of 1.14 V to 1.26 V to match system power domains and regulator designs.
• Mounting and Grade  Surface-mount device, commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Prototyping and Development  Implement and validate custom digital logic and system functions using the large logic element count and on-chip RAM.
• High‑Density I/O Control  Manage boards or subsystems that require many parallel interfaces, leveraging up to 480 I/Os for sensor, actuator, or peripheral connections.
• Embedded Memory-Dependent Designs  Support buffering, small data tables, and local storage using the device’s approximately 4.94 Mbits of embedded RAM.
• System Integration on Compact Boards  Fit substantial programmable logic into compact layouts with the 676-BGA (27×27 mm) package for space-constrained applications.

Unique Advantages

• High logic capacity: The device’s ~101,261 logic elements enable complex custom logic implementations without external programmable devices.
• Substantial on-chip RAM: Approximately 4.94 Mbits of embedded memory reduces dependence on external DRAM for small-to-medium data storage needs.
• Extensive I/O availability: Up to 480 I/Os simplifies interfacing with multiple peripherals and parallel buses, lowering board-level design complexity.
• Compact, high-density package: The 676-FBGA (27 × 27 mm) package provides high pin count in a compact footprint for dense system designs.
• Commercial temperature and RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for mainstream electronic product assemblies.
• Manufacturer support: Backed by AMD documentation to assist integration and reference during development.

Why Choose XC6SLX100-2FG676C?

The XC6SLX100-2FG676C combines a high number of logic elements, meaningful embedded RAM, and a large I/O count in a compact 676-BGA package, making it a practical choice for designers who need substantial programmable resources on board. Its commercial-grade temperature range and RoHS compliance make it suitable for mainstream electronic products that require reliable, documented FPGA capability.

This device is appropriate for development teams and procurement seeking a programmable logic solution that balances integration density, on-chip memory, and flexible I/O for a wide range of board-level designs, with manufacturer documentation available to support implementation.

Request a quote or submit a procurement inquiry to check availability and pricing for the XC6SLX100-2FG676C.