XC6SLX100-2FG484C
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 326 4939776 101261 484-BBGA |
|---|---|
| Quantity | 559 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 326 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7911 | Number of Logic Elements/Cells | 101261 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4939776 |
Overview of XC6SLX100-2FG484C – Spartan®-6 LX FPGA, 484-BBGA, Commercial
The XC6SLX100-2FG484C is a Spartan®-6 LX field programmable gate array (FPGA) IC designed for commercial applications that require programmable logic density, embedded memory, and broad I/O capability. It combines a large logic fabric with substantial on-chip RAM and a high pin-count BGA package to support compact, high-functionality designs.
This device is supplied in a 484-ball BGA (484-FBGA, 23×23) surface-mount package and operates over a commercial temperature range, providing a balanced option for developers targeting scalable, board-level programmable logic solutions.
Key Features
- Core Logic Density — 101,261 logic elements provide extensive programmable logic resources for complex digital designs.
- Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage, and on-chip data processing.
- I/O Capability — 326 I/O pins enable broad connectivity and interfacing options for external peripherals and subsystems.
- Package & Mounting — Supplied in a 484-BBGA package (supplier device package: 484-FBGA, 23×23) and intended for surface-mount assembly.
- Power Supply — Core voltage supply range of 1.14 V to 1.26 V to match board-level power design requirements.
- Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant to support regulatory and manufacturing requirements.
Typical Applications
- Commercial embedded systems — Use the FPGA’s logic capacity and embedded RAM to implement custom processing, control logic, and interface bridging in commercial products.
- Prototyping and development — High logic element count and flexible I/O make this device suitable for prototyping complex digital functions before production.
- High-density I/O control — With 326 I/O pins, the device can manage multiple interfaces, sensors, or actuator arrays on compact boards.
- Custom digital processing — On-chip RAM and large logic resources support application-specific accelerators, data path implementation, and state machines.
Unique Advantages
- High logic integration: 101,261 logic elements reduce the need for multiple discrete devices, simplifying system design.
- Substantial embedded memory: Approximately 4.94 Mbits of on-chip RAM enables local buffering and data handling without external memory in many use cases.
- Extensive I/O capacity: 326 I/O pins provide flexibility for multi-peripheral systems and complex board-level connectivity.
- Compact BGA package: 484-ball FBGA (23×23) offers a high-pin-count solution in a compact surface-mount form factor for dense PCB layouts.
- Commercial temperature and RoHS compliance: Commercial-grade operating range (0 °C to 85 °C) and RoHS status support standard manufacturing and deployment needs.
Why Choose XC6SLX100-2FG484C?
The XC6SLX100-2FG484C positions itself as a capable, commercially graded FPGA option that balances logic density, embedded memory, and extensive I/O in a compact surface-mount BGA package. It is appropriate for designers who need significant programmable resources and on-chip memory while maintaining a manageable board footprint.
This device suits teams building commercial embedded systems, prototypes, and custom digital processing solutions that benefit from scalable logic capacity, robust I/O, and standard manufacturing compliance. Its specification set supports long-term design stability through common package and power characteristics.
Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the XC6SLX100-2FG484C.

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