XC6SLX100-2FG484C

IC FPGA 326 I/O 484FBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 326 4939776 101261 484-BBGA

Quantity 559 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O326Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7911Number of Logic Elements/Cells101261
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4939776

Overview of XC6SLX100-2FG484C – Spartan®-6 LX FPGA, 484-BBGA, Commercial

The XC6SLX100-2FG484C is a Spartan®-6 LX field programmable gate array (FPGA) IC designed for commercial applications that require programmable logic density, embedded memory, and broad I/O capability. It combines a large logic fabric with substantial on-chip RAM and a high pin-count BGA package to support compact, high-functionality designs.

This device is supplied in a 484-ball BGA (484-FBGA, 23×23) surface-mount package and operates over a commercial temperature range, providing a balanced option for developers targeting scalable, board-level programmable logic solutions.

Key Features

  • Core Logic Density — 101,261 logic elements provide extensive programmable logic resources for complex digital designs.
  • Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage, and on-chip data processing.
  • I/O Capability — 326 I/O pins enable broad connectivity and interfacing options for external peripherals and subsystems.
  • Package & Mounting — Supplied in a 484-BBGA package (supplier device package: 484-FBGA, 23×23) and intended for surface-mount assembly.
  • Power Supply — Core voltage supply range of 1.14 V to 1.26 V to match board-level power design requirements.
  • Operating Range & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

  • Commercial embedded systems — Use the FPGA’s logic capacity and embedded RAM to implement custom processing, control logic, and interface bridging in commercial products.
  • Prototyping and development — High logic element count and flexible I/O make this device suitable for prototyping complex digital functions before production.
  • High-density I/O control — With 326 I/O pins, the device can manage multiple interfaces, sensors, or actuator arrays on compact boards.
  • Custom digital processing — On-chip RAM and large logic resources support application-specific accelerators, data path implementation, and state machines.

Unique Advantages

  • High logic integration: 101,261 logic elements reduce the need for multiple discrete devices, simplifying system design.
  • Substantial embedded memory: Approximately 4.94 Mbits of on-chip RAM enables local buffering and data handling without external memory in many use cases.
  • Extensive I/O capacity: 326 I/O pins provide flexibility for multi-peripheral systems and complex board-level connectivity.
  • Compact BGA package: 484-ball FBGA (23×23) offers a high-pin-count solution in a compact surface-mount form factor for dense PCB layouts.
  • Commercial temperature and RoHS compliance: Commercial-grade operating range (0 °C to 85 °C) and RoHS status support standard manufacturing and deployment needs.

Why Choose XC6SLX100-2FG484C?

The XC6SLX100-2FG484C positions itself as a capable, commercially graded FPGA option that balances logic density, embedded memory, and extensive I/O in a compact surface-mount BGA package. It is appropriate for designers who need significant programmable resources and on-chip memory while maintaining a manageable board footprint.

This device suits teams building commercial embedded systems, prototypes, and custom digital processing solutions that benefit from scalable logic capacity, robust I/O, and standard manufacturing compliance. Its specification set supports long-term design stability through common package and power characteristics.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the XC6SLX100-2FG484C.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up