XC6SLX100-2CSG484I

IC FPGA 338 I/O 484CSBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 338 4939776 101261 484-FBGA, CSPBGA

Quantity 1,799 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-CSPBGA (19x19)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-FBGA, CSPBGANumber of I/O338Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7911Number of Logic Elements/Cells101261
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4939776

Overview of XC6SLX100-2CSG484I – Spartan®-6 LX FPGA, 484-CSPBGA (Industrial)

The XC6SLX100-2CSG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) supplied by AMD. It provides a high-density programmable logic fabric with substantial on-chip memory and a large number of I/O in a compact 484-CSPBGA package.

Designed for applications requiring significant logic capacity and I/O count in an industrial temperature range, this device combines 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and 338 I/O pins while operating from a 1.14 V to 1.26 V supply.

Key Features

  • Logic Capacity  Approximately 101,261 logic elements provide a high-density programmable fabric for complex logic implementations.
  • Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
  • I/O  338 user I/O pins to support broad interfacing options and external connectivity.
  • Power Supply  Specified core voltage range of 1.14 V to 1.26 V for device operation.
  • Package and Mounting  484-FBGA / 484-CSPBGA package (484-CSPBGA (19x19)); surface-mount device for high-density board integration.
  • Temperature Grade  Industrial operating range from -40 °C to 100 °C for deployment in demanding environments.
  • Compliance  RoHS compliant.

Unique Advantages

  • High logic density: The large logic element count enables implementation of complex, multi-function designs on a single device, reducing board-level component count.
  • Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM helps minimize external memory requirements for many applications.
  • Extensive I/O capability: 338 I/O pins provide flexibility for parallel interfaces, peripherals, and mixed-signal front ends.
  • Industrial temperature support: Rated from -40 °C to 100 °C to support operation in a wide range of environmental conditions.
  • Compact package: 484-CSPBGA (19x19) surface-mount package balances high pin count with compact PCB footprint for space-constrained designs.
  • Standards-compliant material set: RoHS compliance supports regulatory and manufacturing requirements.

Why Choose XC6SLX100-2CSG484I?

The XC6SLX100-2CSG484I is positioned for designs that require a combination of high logic capacity, meaningful embedded memory, and a large I/O complement within a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for projects that demand environmental robustness and regulatory alignment.

With a clearly defined core voltage range and a dense, surface-mount 484-CSPBGA footprint, this FPGA offers a balanced platform for engineers seeking scalable logic resources and on-chip memory while maintaining a small board footprint and broad interfacing capability.

Request a quote or submit an inquiry to receive pricing and availability information for the XC6SLX100-2CSG484I.

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