XC6SLX100-2FGG484C

The XC6SLX100-2FGG484C is a Spartan®-6 LX field programmable gate array in a 484-ball BGA package, provided as a commercial-grade, surface-mount FPGA. It delivers a large programmable fabric with 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and up to 326 general-purpose I/O pins.

Designed for commercial applications that require high logic capacity, substantial on-chip RAM, and dense I/O in a compact 484-BBGA footprint, this device operates from a 1.14 V to 1.26 V supply and within a 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity  The device provides 101,261 logic elements suitable for complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for data buffering, FIFOs, and local storage without external memory.
• High I/O Count  Up to 326 I/O pins enable dense connectivity to peripherals, sensors, and external devices.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount form factor for compact board layouts.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.26 V, allowing straightforward power design for the FPGA core.
• Operating Range & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
• RoHS Compliance  Environmentally compliant with RoHS requirements.

Typical Applications

• Prototyping and Development  Use the large logic element count and ample embedded memory for board- and system-level prototyping of digital designs.
• Custom Logic and Glue-Logic  Implement custom timing, protocol bridging, and glue logic where dense I/O and flexible routing are required.
• Signal Processing  Leverage on-chip RAM and logic capacity to build buffer-heavy or pipelined signal-processing blocks within a single device.
• Embedded Systems  Integrate control, interfacing, and peripheral handling in commercial embedded applications that operate within the specified temperature and power ranges.

Unique Advantages

• High Logic Density: 101,261 logic elements provide the capacity to implement large-scale digital functions without partitioning across multiple devices.
• Substantial On‑Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory, simplifying PCB design and improving system latency.
• Extensive I/O Resources: 326 I/O pins support numerous interfaces and parallel connections, enabling flexible integration with surrounding circuitry.
• Compact BGA Packaging: The 484-BBGA (23×23) package allows a high-pin-count implementation in a compact board footprint for space-constrained designs.
• Commercial Grade and RoHS Compliant: Specified for 0 °C to 85 °C operation and compliant with RoHS for ease of use in commercial product lines.
• Predictable Power Envelope: Core supply range of 1.14 V to 1.26 V supports defined power budgeting for system power distribution.

Why Choose XC6SLX100-2FGG484C?

The XC6SLX100-2FGG484C positions itself as a high-capacity Spartan‑6 LX FPGA option for commercial designs that require a combination of large logic resources, substantial embedded memory, and dense I/O in a compact BGA package. Its electrical and thermal specifications make it suitable for a wide range of commercial embedded and digital applications.

For designers and procurement teams seeking a programmable, RoHS-compliant device with clear capacity and package information, this FPGA offers a balance of integration and predictable operating parameters to support scalable designs and system consolidation.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX100-2FGG484C and to discuss how its logic, memory, and I/O resources can meet your project requirements.