XC6SLX100-2FGG676I

The XC6SLX100-2FGG676I is a Spartan®-6 LX field programmable gate array (FPGA) supplied in a 676-ball BGA package. It provides a high count of logic resources, embedded memory, and I/O capability in a surface-mount package designed for industrial-grade applications.

With 101,261 logic elements, approximately 4.94 Mbits of embedded memory and 480 user I/O pins, this device targets applications that require substantial on-chip logic density, ample on-chip RAM, and broad external connectivity while operating across a wide industrial temperature range.

Key Features

• Core — Logic Capacity 101,261 logic elements for implementing complex digital designs and system-level logic integration.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs and block memory requirements without external memory in many designs.
• I/O Count 480 user I/O pins to enable broad peripheral interfacing and multi-channel connectivity.
• Package & Mounting 676-BGA package (supplier device package: 676-FBGA, 27 × 27) with surface-mount construction for compact board layouts.
• Power Supply Supply voltage range from 1.14 V to 1.26 V to match precise core supply requirements.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C and specified as industrial grade for demanding environmental conditions.
• Regulatory Compliance RoHS compliant to support environmentally conscious designs and manufacturing.

Unique Advantages

• Substantial on-chip logic: 101,261 logic elements allow integration of large FPGA designs and reduce the need for multiple devices.
• Generous embedded RAM: Approximately 4.94 Mbits of embedded memory supports data buffering and local storage, simplifying external memory requirements.
• High I/O density: 480 I/O pins enable connectivity to multiple peripherals and parallel interfaces without extensive board-level multiplexing.
• Industrial robustness: Operation from −40 °C to 100 °C suits applications that require extended temperature capability.
• Compact BGA packaging: The 676-FBGA (27 × 27) package balances high pin count and small board footprint for space-constrained designs.
• RoHS compliance: Contributes to regulatory and environmental requirements for modern manufacturing processes.

Why Choose XC6SLX100-2FGG676I?

The XC6SLX100-2FGG676I positions itself as a high-capacity, industrial-grade FPGA option that combines substantial logic resources, multi-megabit embedded memory and a large I/O complement in a compact BGA package. These attributes make it well suited to designs requiring dense logic implementation and broad peripheral interfacing under extended temperature ranges.

For engineers and procurement teams building systems that demand on-chip integration, predictable supply-voltage requirements, and RoHS compliance, this Spartan-6 LX device delivers a balance of capacity, connectivity and environmental robustness that supports mid-to-high complexity FPGA applications.

Request a quote or submit your procurement inquiry to receive pricing and availability for the XC6SLX100-2FGG676I.