XC6SLX100-3FGG484I

The XC6SLX100-3FGG484I is a Spartan®-6 LX field programmable gate array (FPGA) in a 484-ball BGA package intended for programmable logic implementations. It provides a high-density logic fabric with substantial on-chip memory and a wide I/O count, making it suitable for designs that require configurable digital logic and extensive interfacing capability.

Key on-chip resources include 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and 326 general-purpose I/O pins, combined with an industrial-grade operating range and surface-mount 484-ball BGA package.

Key Features

• Logic Capacity  101,261 logic elements provide a large fabric for complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O  326 I/O pins accommodate extensive external connectivity for sensors, buses, and peripheral interfaces.
• Package and Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) with surface-mount mounting for compact board integration.
• Power  Nominal core voltage range from 1.14 V to 1.26 V to match system power rails and design constraints.
• Temperature Range  Industrial operating temperature range from −40 °C to 100 °C for deployments in thermally demanding environments.
• Compliance  RoHS-compliant status for regulatory and environmental considerations.

Typical Applications

• Industrial Control  Implements custom control logic and high-pin-count interfacing for motor drives, PLCs, and factory automation within an industrial temperature range.
• Communications and Networking  Provides programmable datapath and buffering with substantial logic and embedded memory for packet processing and protocol handling.
• Test and Measurement  Enables configurable signal conditioning, timing, and data aggregation using on-chip RAM and extensive I/O connectivity.

Unique Advantages

• High Logic Density: 101,261 logic elements allow integration of large or multiple logic functions on a single device, reducing external component count.
• Significant On-Chip Memory: Approximately 4.94 Mbits of embedded RAM supports local buffering and state machines without relying on external memory.
• Extensive I/O: 326 I/O pins deliver flexible interfacing options to connect to sensors, buses, and peripherals directly from the FPGA.
• Industrial Temperature Rating: −40 °C to 100 °C operation suits deployments where thermal reliability matters.
• Compact BGA Packaging: 484-ball BGA (484-FBGA, 23×23) enables a high-pin-count solution in a compact surface-mount footprint for space-constrained PCBs.
• Regulatory Compliance: RoHS compliance aids in meeting environmental and manufacturing requirements.

Why Choose XC6SLX100-3FGG484I?

The XC6SLX100-3FGG484I balances large programmable logic capacity, meaningful embedded memory, and extensive I/O in a compact 484-ball BGA package. Its industrial-temperature rating and RoHS compliance make it suitable for a range of professional and industrial-grade electronic systems where configurable logic and board-level integration are priorities.

This device is well suited for designers seeking a scalable FPGA platform that consolidates logic, memory, and I/O to reduce BOM complexity while meeting thermal and regulatory requirements.

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