XC6SLX100-3FGG676I

The XC6SLX100-3FGG676I is a Spartan®-6 LX field-programmable gate array (FPGA) from AMD, supplied in a 676-ball BGA package. It provides a high count of logic elements, substantial on-chip RAM, and a large number of general-purpose I/Os for demanding industrial applications.

Designed for industrial-grade deployments, this device combines dense programmable logic with a wide operating temperature range and a tightly specified core supply, enabling deployment in systems that require robustness and configurability.

Key Features

• Core Logic Capacity  101,261 logic elements provide significant programmable fabric for implementing complex digital designs.
• Logic Blocks  7,911 configurable logic blocks (CLBs) for structured RTL implementation and resource partitioning.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
• I/O Density  480 general-purpose I/Os to support wide parallel interfaces and multiple peripheral connections.
• Power and Supply  Core voltage supply range of 1.14 V to 1.26 V for the device core domain.
• Package and Mounting  676-ball FBG A package (27 × 27 mm) in a surface-mount form factor for high-density PCB implementations.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environment requirements.
• Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.
• Manufacturer  Supplied by AMD, a recognized provider of programmable logic devices.

Typical Applications

• Industrial Control Systems  Use the device’s industrial temperature rating and extensive I/O to implement custom control logic and interface to sensors and actuators.
• High-Density Logic Implementations  Leverage more than 100k logic elements and ~4.94 Mbits of embedded RAM for complex digital processing and custom IP integration.
• Custom I/O and Interface Hubs  The 480 I/Os enable aggregation and protocol bridging for systems that require flexible, high-count external connectivity.

Unique Advantages

• High Logic Capacity: More than 101k logic elements accommodate large logic designs and multi-function implementations.
• Substantial On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary data storage.
• Extensive I/O Count: 480 I/Os simplify board-level routing for parallel interfaces and multiple peripheral connections, reducing the need for additional I/O expanders.
• Industrial-Grade Operation: −40 °C to 100 °C operating range supports deployment in harsher environments where thermal margins matter.
• Compact BGA Footprint: 676-FBGA (27 × 27 mm) enables high pin count in a compact surface-mount package suitable for dense PCB layouts.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing and simplifies regulatory considerations.

Why Choose XC6SLX100-3FGG676I?

The XC6SLX100-3FGG676I combines a large pool of logic resources, substantial embedded memory, and a high I/O count in an industrial-grade FPGA package. Its electrical and thermal specifications provide a deterministic foundation for designs that require robust, configurable logic in challenging environments.

This device is well suited to engineering teams building industrial control, communications interface, or high-density digital subsystems that need on-chip resources and a compact BGA form factor. The AMD supply and RoHS compliance further support long-term manufacturability and regulatory alignment.

Request a quote or submit an inquiry for pricing and availability to evaluate the XC6SLX100-3FGG676I for your next design.