XC6SLX100-L1FG676C

The XC6SLX100-L1FG676C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC designed for commercial-grade embedded applications. It delivers substantial logic capacity and on-chip memory, combined with a high I/O count in a compact 676‑FBGA (27×27) surface-mount package.

Key attributes include approximately 101,261 logic elements, roughly 4.94 Mbits of embedded RAM, and 480 I/O pins, all operating across a 1.14 V to 1.26 V supply range and 0 °C to 85 °C commercial temperature range. The device is RoHS compliant.

Key Features

• Core Capacity  Approximately 101,261 logic elements to implement complex custom logic and parallel processing functions.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for buffering, FIFOs, and data storage without external memory in many use cases.
• I/O Density  480 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count system interconnects.
• Power Supply  Operates from a 1.14 V to 1.26 V core supply, enabling predictable power planning for system design.
• Package & Mounting  Supplied in a 676‑FBGA (27×27) package, optimized for surface-mount assembly to save board area and support dense layouts.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic products.
• Environmental Compliance  RoHS compliant to meet common environmental and regulatory expectations for commercial products.

Typical Applications

• I/O‑dense interface control: Use the 480 I/O pins to implement multi-channel interfaces, parallel data capture, and board-level bridging between subsystems.
• Custom digital logic and prototyping: Leverage the approximately 101,261 logic elements to develop and validate bespoke logic blocks and system functions.
• On-chip buffering and data handling: Apply the ~4.94 Mbits of embedded RAM for packet buffering, FIFOs, and temporary storage in streaming and buffering applications.
• Compact, surface-mount designs: Integrate the 676‑FBGA package into space-constrained PCBs for commercial embedded products.

Unique Advantages

• High logic capacity: Approximately 101,261 logic elements enable implementation of substantial custom logic without resorting to multiple devices.
• Significant on-chip memory: Nearly 5 Mbits of embedded RAM reduces dependency on external memory for many buffering and data-processing tasks.
• Extensive I/O support: 480 I/O pins simplify integration with numerous peripherals and high-pin-count interfaces.
• Compact package for dense boards: The 676‑FBGA (27×27) offers a small footprint with high ball count for dense routing and minimized board area.
• Commercial temperature range: Rated 0 °C to 85 °C for deployment in general commercial electronic systems.
• RoHS compliant: Meets common environmental requirements for modern electronic products.

Why Choose XC6SLX100-L1FG676C?

The XC6SLX100-L1FG676C combines substantial programmable logic, meaningful embedded memory, and a large I/O complement in a compact 676‑FBGA surface-mount package, making it well suited for commercial embedded designs that require integration of custom digital functions and extensive interfacing. Its defined voltage supply range and commercial temperature rating provide predictable integration into power and thermal plans.

This part is a practical choice for engineers designing I/O-intensive systems, prototypes that require significant on-chip resources, and compact PCB implementations where board area and component count are important considerations.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX100-L1FG676C and to discuss how it can meet your project requirements.