XC6SLX100-L1FG676I

The XC6SLX100-L1FG676I is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD, packaged in a 676-ball BGA. It provides a large on-chip logic capacity and substantial embedded RAM for designs that require high logic density and extensive I/O.

Key device characteristics include 101,261 logic elements, approximately 4.94 Mbits of embedded memory, 480 I/Os, and an industrial operating temperature range of -40 °C to 100 °C. The device is designed for surface-mount assembly and operates from a core supply between 1.14 V and 1.26 V.

Key Features

• Core Logic 101,261 logic elements (cells) providing high-capacity programmable logic for complex custom designs.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support data buffering, state storage, and intermediate processing.
• I/O Density 480 general-purpose I/Os to support broad interfacing and parallel connectivity requirements.
• Power Supply Core voltage range of 1.14 V to 1.26 V for compatibility with targeted power architectures.
• Package 676-ball BGA package (supplier device package: 676-FBGA, 27×27) optimized for high pin-count, compact board footprints.
• Thermal and Reliability Industrial-grade operating range from -40 °C to 100 °C for deployment in demanding temperature environments.
• Mounting Surface-mount package suitable for automated PCB assembly processes.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control — Use in control systems and automation equipment where industrial temperature ratings and extensive I/O are required.
• High-Density I/O Systems — Ideal for applications needing many parallel interfaces or significant signal routing thanks to 480 I/Os and a high-pin-count BGA package.
• Custom Logic and Glue Logic — Implement custom processing, protocol adaptation, and interface bridging using large programmable logic resources and embedded RAM.

Unique Advantages

• High Logic Capacity: 101,261 logic elements enable implementation of sizeable custom logic functions without external ASICs or discrete glue components.
• Substantial On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
• Extensive I/O Count: 480 I/Os support complex multi-channel interfaces and parallel data paths, simplifying board-level connectivity.
• Industrial Temperature Range: Rated from -40 °C to 100 °C for reliable operation in thermally demanding environments.
• Compact High-Pin Package: 676-FBGA (27×27) provides a high pin count in a compact footprint for space-constrained designs.
• RoHS Compliant: Meets lead-free and restricted-substance requirements for regulatory compliance.

Why Choose XC6SLX100-L1FG676I?

The XC6SLX100-L1FG676I positions itself as a high-capacity, industrial-grade Spartan®-6 LX FPGA suited for designs that require a combination of large programmable logic, significant embedded memory, and high I/O density. Its 676-ball BGA package and surface-mount form factor make it suitable for compact, production-scale PCBs.

This device is appropriate for engineering teams building control systems, high-density interface modules, or custom logic solutions that demand stable operation across a wide temperature range and adherence to RoHS requirements.

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