XC6SLX100-N3CSG484C

The XC6SLX100-N3CSG484C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD. It delivers a programmable logic fabric with substantial logic capacity, on-chip memory, and a high I/O count in a compact 484‑FBGA (19×19) surface‑mount package.

Key Features

• Programmable Logic Capacity  101,261 logic elements provide a broad fabric for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 4.94 Mbits of total on‑chip RAM to support buffering, local storage, and state machine implementations.
• High I/O Count  338 user I/Os for flexible interfacing with external peripherals and subsystems.
• Power Supply  Core supply range of 1.14 V to 1.26 V for predictable core power delivery and design planning.
• Package and Mounting  484‑CSPBGA (19×19) package, surface mount, offering a compact BGA footprint for board integration.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial‑grade system deployments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Custom digital logic implementations  Use the FPGA’s 101,261 logic elements to realize complex state machines, protocol engines, or control logic within a single device.
• I/O‑intensive subsystem integration  The 338 available I/Os enable consolidation of multiple interfaces and peripherals onto the FPGA for streamlined board design.
• Memory‑dependent designs  Approximately 4.94 Mbits of embedded RAM supports local buffering and temporary storage needs for data paths and control structures.
• Space‑conscious board layouts  The 484‑FBGA (19×19) surface‑mount package provides a dense, compact footprint for designs with PCB area constraints.

Unique Advantages

• Substantial logic resources: 101,261 logic elements enable implementation of sizable digital designs without immediate need for multiple devices.
• Embedded memory capacity: Approximately 4.94 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and state storage tasks.
• High interface density: 338 I/Os provide flexibility to connect numerous peripherals, sensors, or buses directly to the FPGA.
• Compact BGA packaging: The 484‑CSPBGA (19×19) package supports high pin density in a space‑efficient form factor.
• Predictable core supply: Defined supply range (1.14 V–1.26 V) aids in power budgeting and regulator selection.
• Commercial readiness: Rated 0 °C–85 °C and RoHS compliant for standard commercial product deployments.

Why Choose XC6SLX100-N3CSG484C?

The XC6SLX100-N3CSG484C combines a large programmable fabric, significant on‑chip memory, and a high I/O count in a compact 484‑FBGA package, making it a practical choice for designs that require consolidation of logic and interfaces while conserving board space. Its commercial temperature rating and RoHS compliance align it with typical commercial product development and procurement requirements.

This part is suited to designers and teams seeking a single‑device solution that balances logic capacity, embedded memory, and I/O density in a surface‑mount BGA footprint.

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