XC6SLX100-N3FG484I

The XC6SLX100-N3FG484I is a Spartan®-6 LX field programmable gate array (FPGA) from AMD. This device provides a high-density programmable fabric with 101,261 logic elements and approximately 4.94 Mbits of embedded memory for designs requiring substantial on-chip resources.

Key platform-level characteristics include 326 user I/O pins, a 484-ball BGA package (supplier package: 484-FBGA, 23×23), surface-mount mounting, a supply voltage range of 1.14 V to 1.26 V, and an industrial operating temperature range of −40 °C to 100 °C. The device is RoHS compliant.

Key Features

• Logic Capacity — 101,261 logic elements to implement complex digital functions and custom processing blocks.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, local storage, and memory-intensive logic.
• I/O Density — 326 user I/O pins to interface with multiple peripherals, sensors, and external devices.
• Power — Operating supply voltage specified from 1.14 V to 1.26 V to match system power rails and design requirements.
• Package — 484-BBGA package (supplier: 484-FBGA, 23×23) optimized for compact board layouts and thermal considerations.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployments in environments with wide temperature variation.
• Mounting and Compliance — Surface-mount device with RoHS compliance for modern manufacturing and environmental requirements.

Typical Applications

• High-density digital logic — Use the substantial logic element count for custom processing, protocol implementation, and hardware acceleration.
• Memory-intensive functions — Leverage approximately 4.94 Mbits of embedded memory for buffering, FIFOs, and local data storage.
• I/O-rich systems — Support multi-interface designs and extensive peripheral connectivity with 326 user I/O pins.
• Industrial electronics — Deploy in systems requiring extended temperature operation between −40 °C and 100 °C.

Unique Advantages

• High on-chip resource density: 101,261 logic elements and substantial embedded RAM enable integration of complex functions on a single device, reducing board-level BOM.
• Wide I/O capability: 326 user I/O pins provide flexibility for connecting numerous interfaces without external multiplexing.
• Industrial temperature support: Rated operation from −40 °C to 100 °C for robust performance in temperature-challenging environments.
• Compact package: 484-BBGA (484-FBGA, 23×23) supports dense PCB implementations while maintaining manufacturability as a surface-mount device.
• Controlled supply range: Specified 1.14 V to 1.26 V supply window facilitates integration into regulated system power domains.
• RoHS compliant: Meets environmental manufacturing requirements for lead-free assembly.

Why Choose XC6SLX100-N3FG484I?

The XC6SLX100-N3FG484I combines a large logic element count, significant embedded memory, and a high number of user I/Os in a compact 484-BBGA package, making it well suited for designs that require on-chip integration of complex digital functions and substantial buffering. Its industrial temperature rating and RoHS compliance align with demanding production and environmental requirements.

As a member of the Spartan®-6 family from AMD, this device provides designers with a balance of capacity and integration for medium- to high-complexity applications where reliable operation across a wide temperature range and clear hardware resources are priorities.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX100-N3FG484I and to discuss how this FPGA can fit your project requirements.