XC6SLX100-N3FGG676C

The XC6SLX100-N3FGG676C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) offered in a 676‑ball BGA package. It provides a balance of programmable logic capacity, on-chip memory, and I/O density for commercial embedded designs.

With 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and 480 I/O pins, this device suits applications that require significant logic resources and a high count of external interfaces while operating within commercial temperature and voltage ranges.

Key Features

• Logic Capacity — 101,261 logic elements to implement complex custom logic and control functions.
• Embedded Memory — Approximately 4.94 Mbits of on‑chip RAM for buffers, FIFOs, and data storage without external memory.
• I/O Resources — 480 user I/O pins to support multiple external interfaces and parallel connections.
• Power Supply — Supported core voltage range from 1.14 V to 1.26 V for defined power anchoring and system integration.
• Package & Mounting — 676‑BGA (supplier package: 676‑FBGA, 27×27) in a surface‑mount configuration for compact, high‑pin‑count board designs.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS‑compliant to meet common environmental requirements.

Unique Advantages

• High logic density: 101,261 logic elements enable implementation of large custom hardware accelerators and complex state machines without partitioning across multiple devices.
• Substantial on‑chip RAM: Approximately 4.94 Mbits of embedded memory reduces dependence on external memory components and simplifies board design.
• Extensive I/O availability: 480 I/Os give designers flexibility to connect multiple peripherals, sensors, and high‑pin interfaces directly to the FPGA.
• Compact, high‑pin‑count package: The 676‑BGA (27×27) package delivers a dense footprint for systems where board space and routing density matter.
• Defined commercial operating range: Rated for 0 °C to 85 °C and commercial grade use, matching requirements for many embedded and consumer applications.
• Regulatory alignment: RoHS compliance supports environmental and manufacturing standards for many production programs.

Why Choose XC6SLX100-N3FGG676C?

The XC6SLX100-N3FGG676C positions itself as a commercially graded, high‑capacity Spartan®‑6 LX FPGA that combines a large logic resource pool with meaningful on‑chip memory and a high I/O count in a compact BGA package. It is suited to teams needing programmable hardware density, flexible I/O, and the ability to consolidate functions on a single device while remaining within defined voltage and temperature parameters.

This device offers designers a reliable platform for scaling custom logic implementations, reducing external component count through embedded memory, and maintaining environmental compliance. Its package and pin count support dense, feature‑rich board designs where integration and I/O flexibility are priorities.

Request a quote or submit a procurement inquiry to receive pricing and availability details for the XC6SLX100-N3FGG676C.