XC6SLX100T-2FG676C

The XC6SLX100T-2FG676C is a Spartan®-6 LXT field-programmable gate array (FPGA) from AMD, provided in a 676-ball BGA package. It delivers a balanced combination of logic density, embedded memory, and I/O capacity for commercial programmable-logic applications.

With 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and 376 user I/Os, this device targets designs that require substantial on-chip resources in a compact surface-mount package while operating within a commercial temperature range.

Key Features

• Core Logic  101,261 logic elements and 7,911 CLBs provide ample programmable logic resources for complex glue logic and custom processing functions.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM supports data buffering, FIFOs, and small embedded memories without external SDRAM.
• I/O Capacity  376 user I/Os enable wide parallel interfaces, multiple peripheral connections, and flexible board-level routing options.
• Power  Specified device supply range of 1.14 V to 1.26 V for core operation, allowing designs to target the device’s required power domain.
• Package & Mounting  676-FBGA (27 × 27 mm) package in a surface-mount form factor provides a compact, high-pin-count solution for PCB integration.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C suited to general-purpose commercial electronic systems.
• Compliance  RoHS-compliant construction support environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Commercial embedded systems  Use as the programmable logic backbone for custom control, data handling, and peripheral interface tasks in commercial equipment.
• Communications equipment  Implement protocol bridging, packet handling, and interface logic where moderate logic density and on-chip memory are required.
• Test and measurement  Provide configurable I/O and logic to implement signal conditioning, data aggregation, and custom measurement algorithms.
• Prototyping and development  Serve as a development platform for validating digital architectures and hardware accelerators before production implementation.

Unique Advantages

• High logic capacity: 101,261 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces reliance on external memory for buffering and small storage needs.
• Extensive I/O: 376 user I/Os allow flexible connectivity to peripherals, sensors, and parallel interfaces without external multiplexing.
• Compact BGA package: The 676-FBGA (27 × 27) package delivers high pin count in a compact footprint for space-constrained PCBs.
• Commercial-grade operation: Rated 0 °C to 85 °C and RoHS-compliant, suitable for a wide range of commercial electronic products.
• Defined core power range: Narrow core supply specification (1.14 V–1.26 V) simplifies power-domain planning on multi-voltage boards.

Why Choose XC6SLX100T-2FG676C?

The XC6SLX100T-2FG676C combines a high count of logic elements and CLBs with several megabits of embedded RAM and a large set of I/Os in a compact 676-ball FBGA. This configuration is suited to commercial designs that need significant on-chip resources and flexible interfacing while maintaining a compact PCB footprint.

As a commercial-grade Spartan®-6 LXT FPGA from AMD, the device is appropriate for engineering teams building scalable, reprogrammable logic solutions for communication, measurement, and embedded applications where integration, I/O capacity, and embedded memory are key design drivers.

If you would like pricing, availability, or a formal quote for the XC6SLX100T-2FG676C, submit a request and our team will respond with the next steps for procurement and support.