XC6SLX100T-2FGG484C

The XC6SLX100T-2FGG484C is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD, supplied in a 484-ball BGA package. It provides a high logic capacity combined with substantial on-chip memory and a large I/O count for commercial embedded and digital designs.

This device delivers up to 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and 296 I/O pins, all in a surface-mount 484-BBGA (supplier package 484-FBGA, 23×23) package. It operates from a 1.14 V to 1.26 V core supply and is specified for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Logic  101,261 logic elements provide capacity for complex combinational and sequential logic integration.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for data buffering, FIFOs, and intermediate storage without external memory.
• I/O Capacity  296 general-purpose I/O pins to support broad interfacing needs and multiple parallel buses.
• Package & Mounting  Surface-mount 484-BBGA package (supplier device package: 484-FBGA, 23×23) for compact board-level integration.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power rails and regulators.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard temperature environments.
• Environmental Compliance  RoHS compliant, supporting lead-free assembly and regulatory requirements.

Typical Applications

• High-density digital logic  Implements large-scale combinational and sequential designs leveraging 101,261 logic elements.
• On-chip buffering and memory  Uses approximately 4.94 Mbits of embedded memory for data buffering, packet queues, or intermediate storage without external RAM.
• Multiport I/O systems  Supports systems with extensive parallel interfaces and signal routing through 296 I/O pins.

Unique Advantages

• High logic capacity:  101,261 logic elements enable consolidation of multiple functions into a single device, reducing system complexity and BOM count.
• Significant on-chip memory:  Approximately 4.94 Mbits of embedded RAM minimizes dependence on external memory for many buffering and data-path tasks.
• Large I/O complement:  296 I/O pins facilitate broad connectivity and support for multiple parallel interfaces on compact boards.
• Compact BGA package:  484-BBGA (484-FBGA, 23×23) supports space-constrained PCB layouts while enabling automated surface-mount assembly.
• Commercial temperature and RoHS compliance:  Specified 0 °C to 85 °C operation and RoHS compliance simplify selection for standard commercial products and manufacturing.

Why Choose XC6SLX100T-2FGG484C?

The XC6SLX100T-2FGG484C is positioned for designs that require a balance of large logic capacity, meaningful on-chip memory, and extensive I/O in a compact surface-mount BGA package. Its Spartan®-6 LXT architecture and AMD manufacturing provide a practical solution for commercial embedded and digital systems that need significant integration without moving to larger form factors.

Choose this FPGA when your design calls for substantial logic and memory resources, broad interfacing capability, and standard commercial temperature operation—all in a RoHS-compliant, surface-mount 484-BBGA package.

Request a quote or submit an inquiry to procure XC6SLX100T-2FGG484C for your next design project.