XC6SLX100T-2FGG484I

The XC6SLX100T-2FGG484I is a Spartan®-6 LXT field programmable gate array from AMD designed for high-density, industrial-grade programmable logic applications. It provides a substantial mix of logic, on-chip memory and I/O in a compact 484-ball BGA package suitable for surface-mount assembly.

With 101,261 logic elements, approximately 4.94 Mbits of embedded memory and 296 I/O, this device addresses designs that require significant programmable resources while operating across an industrial temperature range.

Key Features

• Core Logic  101,261 logic elements and 7,911 configurable logic blocks (CLBs) provide substantial programmable resource density for complex digital designs.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
• I/O Capacity  296 user I/O pins enable extensive external device interfacing and system integration.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23 × 23) optimized for surface-mount PCB assembly and high-density layouts.
• Power  Core operating voltage range of 1.14 V to 1.26 V for predictable power integration in system designs.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for a wide range of environmental conditions.
• Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control  Use the industrial temperature rating, ample logic resources and abundant I/O for motor control, PLC functions and factory automation logic.
• Embedded Signal Processing  Leverage the combination of logic density and on-chip RAM for real-time data buffering and processing tasks in embedded equipment.
• Interface Bridging  Implement protocol translation and parallel/serial bridging where numerous I/O and flexible logic are required.

Unique Advantages

• High Logic Density: 101,261 logic elements provide the capacity to implement complex state machines, datapaths and custom accelerators on a single device.
• Significant On‑Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level BOM.
• Extensive I/O Count: 296 I/O pins enable broad connectivity to sensors, peripherals and other system components without multiplexing compromises.
• Industrial Reliability: Rated for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial environments.
• Compact, Assembly‑Friendly Package: 484-ball BGA (23 × 23) provides a high-density footprint suitable for modern PCB layouts and surface-mount manufacturing.

Why Choose XC6SLX100T-2FGG484I?

The XC6SLX100T-2FGG484I balances high logic capacity, on-chip memory and expansive I/O in a package designed for surface-mount production and industrial operation. Its electrical and thermal specifications make it well suited to engineers building robust embedded systems that require programmable flexibility and board-level integration.

This device is appropriate for design teams seeking a scalable FPGA resource set for control, signal processing and interface functions, offering long-term value through a combination of integration, environmental range and standards compliance.

Request a quote or submit an inquiry to check availability and pricing for the XC6SLX100T-2FGG484I and to discuss how it fits your next design.