XC6SLX100T-2FGG676I

The XC6SLX100T-2FGG676I is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD, delivered in a 676-ball BGA package. It provides a high-capacity programmable logic fabric with substantial embedded memory and a large I/O complement for demanding, space-constrained designs.

With industrial-grade temperature rating and low-voltage core operation, this FPGA supports a range of designs that require configurable digital logic, extensive on-chip RAM, and dense external connectivity while maintaining compliance with RoHS requirements.

Key Features

• Core Logic Capacity  Approximately 101,261 logic elements available for implementing custom digital functions and complex finite-state machines.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM (4,939,776 total RAM bits) for buffering, FIFOs, and local data storage.
• I/O Density  376 user I/O pins to support high channel counts, parallel interfaces, and mixed I/O topologies.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match targeted system power rails and drive core logic efficiently.
• Package and Mounting  676-ball FBGA (27×27 mm) with surface-mount assembly for compact board integration and high-density routing.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for reliability across extended environmental conditions.
• Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Custom digital logic and prototyping  Use the programmable fabric and large logic capacity to implement and iterate complex digital designs.
• Embedded control and interface bridging  Leverage abundant I/O and on-chip RAM to manage protocol translation, bus bridging, and control logic.
• High-density I/O management  Ideal for designs that need to aggregate many signals or implement parallel data paths with a high pin count.

Unique Advantages

• High logic density: 101,261 logic elements provide the capacity to implement sizable designs without immediate external logic expansion.
• Substantial on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• Extensive I/O capability: 376 I/O pins enable flexible interfacing to peripherals, sensors, and high-channel-count systems.
• Industrial temperature operation: Rated from −40 °C to 100 °C for dependable operation in harsher environments.
• Compact BGA footprint: 676-ball FBGA (27×27 mm) supports high-density PCB integration while keeping board area minimized.
• Low-voltage core: 1.14 V to 1.26 V supply range aligns with modern low-voltage system designs.

Why Choose XC6SLX100T-2FGG676I?

The XC6SLX100T-2FGG676I balances large programmable logic resources, meaningful on-chip RAM, and a high I/O count in a compact BGA package, making it suitable for engineers building midsize to large FPGA-based systems that require flexibility and integration. Its industrial temperature rating and RoHS compliance add practical value for long-life deployments.

This part is well suited for teams needing scalable programmable logic capacity with robust I/O and embedded memory, and for projects where board-space efficiency and low-voltage operation are important design considerations.

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