XC6SLX100T-2FG900I

The XC6SLX100T-2FG900I is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) manufactured by AMD, offered in a 900-ball BGA package. This industrial-grade FPGA provides a large logic fabric and extensive I/O capacity for embedded and industrial designs that require on-chip memory and configurable logic.

Key hardware attributes include 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and 498 user I/O pins, making the device suitable for designs that demand high logic density and broad external connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity — 101,261 logic elements provide substantial programmable fabric for implementing complex digital functions and custom logic architectures.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM (4,939,776 bits) to support buffering, state storage, and data-path implementations without requiring external memory for many use cases.
• I/O Density — 498 user I/O pins to support extensive interfacing with external peripherals, sensors, and other system components.
• Power Supply Range — Operates from 1.14 V to 1.26 V, providing defined core-voltage requirements for system power budgeting and board-level design.
• Package & Mounting — 900-ball BGA (900-FBGA, 31 × 31 mm) in a surface-mount package suitable for high-density PCB integration.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, making the device appropriate for industrial environments.
• RoHS Compliant — Built to meet RoHS environmental requirements.

Typical Applications

• Industrial Control and Automation — Use the device’s industrial temperature rating and high I/O count to implement motor control, PLC functions, and equipment interfacing in factory environments.
• Embedded System Integration — Leverage large logic capacity and on-chip memory for custom protocol handling, glue logic, and system orchestration in embedded platforms.
• High-Density I/O Bridging — 498 I/O pins enable bridging between multiple peripheral buses, sensors, and external interfaces in communication or instrumentation equipment.
• Data Buffering and Processing — Approximately 4.94 Mbits of on-chip RAM supports local buffering and real-time data handling for signal processing tasks.

Unique Advantages

• High Logic Integration: 101,261 logic elements allow consolidation of multiple discrete functions into a single device, reducing BOM count.
• Substantial Embedded Memory: Approximately 4.94 Mbits of on-chip RAM minimizes reliance on external memory for many use cases, simplifying board layout and reducing latency.
• Extensive External Connectivity: 498 I/O pins support complex peripheral and sensor interfaces without additional multiplexing hardware.
• Industrial Reliability: −40 °C to 100 °C operating range and industrial grade selection support deployment in demanding environments.
• Compact Surface-Mount Packaging: 900-ball BGA (31 × 31 mm) enables high-density PCB integration for space-constrained designs.
• Standards-Conscious Manufacturing: RoHS compliance aligns the device with common environmental and materials requirements.

Why Choose XC6SLX100T-2FG900I?

The XC6SLX100T-2FG900I positions itself as an industrial-grade FPGA option that pairs a large programmable fabric with substantial on-chip memory and broad I/O capability. These attributes make it well suited for engineers implementing complex embedded logic, high-density interfacing, and memory-backed data paths in industrial and embedded systems.

For development teams and procurement focused on robustness and integration, this device offers a balance of logic capacity, memory resources, and industrial operating range that supports longer-term deployment and system scalability within the constraints of its specified voltage and package characteristics.

Request a quote or submit a pricing inquiry to evaluate the XC6SLX100T-2FG900I for your next design.