XC6SLX100T-2FGG676C

The XC6SLX100T-2FGG676C is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD, provided in a 676-BGA surface-mount package. It delivers a balance of logic capacity, embedded memory and I/O in a commercial-grade device.

With 101,261 logic elements, approximately 4.94 Mbits of embedded memory and 376 user I/O, this device targets commercial embedded designs that require substantial programmable logic and flexible I/O within a compact 27 × 27 mm FBGA footprint.

Key Features

• Core Logic — 101,261 logic elements and 7,911 CLBs provide significant programmable logic resources for complex glue logic, custom accelerators and protocol handling.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory for many use cases.
• I/O Capacity — 376 user I/O pins enable wide peripheral connectivity and multiple interface implementations within a single device.
• Package — 676-BGA (supplier package: 676-FBGA, 27 × 27 mm) surface-mount package for compact board integration and high pin-count routing density.
• Power — Specified core supply range of 1.14 V to 1.26 V to match system power-rail planning and voltage budgeting.
• Operating Range — Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
• RoHS Compliant — Meets RoHS environmental requirements for lead-free manufacturing processes.

Typical Applications

• Commercial Embedded Systems — Use where substantial programmable logic and memory are needed within a commercial temperature range.
• I/O-Intensive Designs — Suitable for designs requiring many external interfaces, leveraging the 376 available I/O pins for sensors, peripherals and custom interfaces.
• On-Chip Data Handling — Embedded memory capacity supports buffering and local data paths to reduce dependence on external RAM.

Unique Advantages

• High Logic Density: 101,261 logic elements and 7,911 CLBs enable implementation of complex logic functions and parallel processing within a single FPGA.
• Substantial Embedded Memory: Approximately 4.94 Mbits of on-chip RAM provide local storage for FIFOs, packet buffers and intermediate data without immediate external memory needs.
• Extensive I/O: 376 user I/O pins support multiple interfaces and expandability, simplifying board-level integration.
• Compact, High-Pin Package: 676-FBGA (27 × 27 mm) offers a high pin count in a compact surface-mount form factor for space-constrained designs.
• Commercial Temperature Grade: Rated for 0 °C to 85 °C operation to meet standard commercial application requirements.
• RoHS Compliance: Supports lead-free manufacturing and environmental compliance goals.

Why Choose XC6SLX100T-2FGG676C?

The XC6SLX100T-2FGG676C positions itself as a commercially graded Spartan-6 LXT FPGA offering a balance of logic resources, embedded memory and high I/O capacity in a compact 676-BGA package. Its specifications make it well suited for engineers and teams building commercial embedded systems that require significant programmable logic, local RAM and broad connectivity within standard temperature and supply-voltage constraints.

Designers can rely on the device’s combination of logic density, on-chip memory and pin count to consolidate functions, reduce external component needs and simplify board integration for medium- to high-complexity FPGA implementations.

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