XC6SLX100T-2FG900C

The XC6SLX100T-2FG900C is a Spartan®-6 LXT field programmable gate array (FPGA) manufactured by AMD. It delivers a high-count programmable logic resource set and embedded RAM in a 900-ball BGA package for compact, surface-mount board designs.

With approximately 101,261 logic elements, roughly 4.94 Mbits of on-chip RAM, and 498 I/O, this commercial-grade device is suited to designs that require substantial programmable logic density and on-chip memory within a defined commercial temperature range.

Key Features

• Programmable Logic Capacity — Approximately 101,261 logic elements to implement complex custom logic and finite-state machines.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM for buffering, LUT-based storage, and data-path staging.
• I/O Count — 498 user I/O pins to support multiple parallel interfaces and peripheral connections.
• Package & Mounting — 900-ball BGA (supplier device package: 900-FBGA, 31 × 31) in a surface-mount form factor for dense board integration.
• Power — Core voltage supply range from 1.14 V to 1.26 V for low-voltage operation.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• Custom digital logic implementations — Use the device to realize complex state machines and bespoke logic where up to approximately 101,261 logic elements are required.
• On-chip buffering and memory-intensive tasks — Leverage approximately 4.94 Mbits of embedded RAM for data buffering, FIFO structures, and intermediate storage.
• High-pin-count interfacing — Employ 498 I/O to connect multiple peripherals, parallel buses, or mixed-signal front-ends in a compact layout.

Unique Advantages

• High logic density: Approximately 101,261 logic elements enable large-scale custom logic implementations without external programmable devices.
• Significant on-chip memory: Approximately 4.94 Mbits of embedded RAM reduces reliance on external memory for many buffer and staging needs.
• Extensive I/O capability: 498 I/O pins support complex interfacing and parallel connectivity directly from the FPGA.
• Compact BGA package: 900-ball BGA (31 × 31) optimizes board area for space-constrained, surface-mount designs.
• Low-voltage core operation: 1.14 V to 1.26 V supply range supports low-power core designs and consistent power budgeting.
• Commercial temperature rating: Rated for 0 °C to 85 °C for typical commercial-environment deployments.

Why Choose XC6SLX100T-2FG900C?

The XC6SLX100T-2FG900C positions itself as a commercial-grade Spartan®-6 LXT FPGA option for designs that require a substantial balance of programmable logic, embedded RAM, and I/O capacity in a compact BGA package. Its combination of approximately 101,261 logic elements, roughly 4.94 Mbits of on-chip memory, and 498 I/O make it suitable for applications where integration and board-area efficiency matter.

Manufactured by AMD and offered in a 900-ball BGA surface-mount package, this device is appropriate for teams designing complex digital systems that need consolidated programmable resources and predictable commercial-temperature operation.

Request a quote for XC6SLX100T-2FG900C to check current availability and pricing or submit a quote request for this FPGA for your next design cycle.