XC6SLX100T-2FG676I

The XC6SLX100T-2FG676I is an AMD Spartan®-6 LXT Field Programmable Gate Array (FPGA) supplied in a 676-ball BGA package. This industrial-grade, surface-mount device provides a combination of programmable logic, on-chip memory, and I/O density for embedded and industrial designs.

Key device attributes include 7,911 CLBs, approximately 101,261 logic elements, roughly 4.94 Mbits of embedded memory, and 376 general-purpose I/O pins. The device operates from a 1.14 V to 1.26 V core supply and supports an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  7,911 CLBs and approximately 101,261 logic elements provide substantial programmable logic capacity for complex designs.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, state storage, and algorithm implementation without external memory.
• I/O Density  376 I/O pins enable extensive peripheral interfacing and signal routing for multi-channel or mixed-signal systems.
• Power  Core voltage supply range of 1.14 V to 1.26 V for predictable power-domain integration in system designs.
• Package & Mounting  676-ball BGA (supplier designation 676-FBGA, 27×27) in a surface-mount form factor to support high pin-count, compact board layouts.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C to meet demanding environmental requirements.
• Environmental Compliance  RoHS compliant for regulatory alignment in commercial and industrial deployments.

Unique Advantages

• High logic capacity: The combination of 7,911 CLBs and ~101,261 logic elements supports feature-rich custom logic and parallel processing.
• Significant on-chip RAM: Approximately 4.94 Mbits of embedded memory reduces reliance on external RAM for many buffering and storage tasks.
• Extensive I/O: 376 I/O pins provide flexibility for multi-channel interfaces, sensor arrays, and dense peripheral connections.
• Industrial temperature range: Rated from −40 °C to 100 °C for use in temperature-demanding environments.
• Compact, high-pin-count package: 676-BGA (676-FBGA, 27×27) enables high-density PCB designs while maintaining robust signal connectivity.
• Standards-aligned materials: RoHS compliance supports regulatory and environmental requirements.

Why Choose XC6SLX100T-2FG676I?

The XC6SLX100T-2FG676I delivers a balanced combination of programmable logic capacity, embedded memory, and high I/O count in an industrial-grade FPGA package. Its specification set—large logic resources, several megabits of on-chip RAM, and a 676-ball BGA footprint—makes it well suited to designs that require substantial integration of custom digital functions while keeping board area compact.

Engineers and procurement teams selecting this device benefit from clear, verifiable specifications for logic, memory, I/O, power, and thermal range, supporting scalable designs and predictable integration into industrial systems.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX100T-2FG676I and to discuss how it can meet your design requirements.