XC6SLX100T-2FGG900I

The XC6SLX100T-2FGG900I is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC from AMD designed for high-density logic and rich I/O integration. It delivers 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and 498 user I/O pins in a 900-ball BGA package, making it suitable for complex embedded and industrial designs that require substantial on-chip resources and I/O capacity.

Designed for surface-mount assembly, the device operates from a 1.14 V to 1.26 V supply and supports an industrial temperature range of −40 °C to 100 °C.

Key Features

• Core Logic  101,261 logic elements provide significant programmable logic capacity for complex designs and parallel processing tasks.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support data buffering, packet storage, and application-specific memory needs.
• I/O Density  498 user I/O pins enable wide interfacing options for peripherals, high-speed buses, and multi-channel designs.
• Power  Operates from a 1.14 V to 1.26 V supply range to match system power architectures and regulator choices.
• Package & Mounting  900-BBGA (supplier package: 900-FBGA, 31×31) in a surface-mount configuration for compact, high-density PCB layouts.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet industrial-environment thermal requirements.
• RoHS Compliant  Conforms to RoHS standards for reduced hazardous substances in manufacturing.

Typical Applications

• Industrial Control  High logic capacity and broad I/O support motor control, programmable logic controllers, and factory automation interfaces.
• Communications Equipment  Large logic fabric and embedded memory make the device suitable for packet processing, protocol bridging, and interface aggregation.
• Data Acquisition & Test Systems  Dense I/O and on-chip RAM enable multi-channel signal capture, preprocessing, and temporary data storage.
• Embedded Prototyping  Offers a platform for developing and validating high-density digital designs that require many logic cells and I/O resources.

Unique Advantages

• High Logic Capacity: 101,261 logic elements provide the headroom needed for complex algorithms and parallel processing in a single device.
• Substantial On‑Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces the need for external memory in many buffering and processing tasks.
• Large I/O Count: 498 I/O pins simplify integration with multiple peripherals and parallel interfaces without extra multiplexing logic.
• Industrial Temperature Suitability: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable environments.
• Compact, High‑Density Package: 900-ball BGA (900-FBGA, 31×31) enables high pin-count integration in space-constrained PCBs.
• RoHS Compliance: Environmentally compliant manufacturing supports broader supply-chain requirements.

Why Choose XC6SLX100T-2FGG900I?

The XC6SLX100T-2FGG900I combines a large logic fabric, substantial embedded memory, and nearly 500 I/O pins in a single surface-mount 900-BBGA package, offering a balanced platform for dense, I/O-rich applications. Its industrial temperature rating and defined supply range make it appropriate for designs that require reliable operation across a wide thermal range.

This device is well suited to engineers and procurement teams building complex embedded systems, communications equipment, or industrial controls who need on-chip memory, high I/O count, and significant programmable logic capacity while maintaining a compact PCB footprint.

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