XC6SLX100T-3FG676I

The XC6SLX100T-3FG676I is a Spartan®-6 LXT field programmable gate array (FPGA) manufactured by AMD and supplied in a 676-ball FBGA (27×27) surface-mount package. It delivers a high logic capacity, abundant I/O and on-chip memory in an industrial-grade device suited to board-level integration.

With approximately 101,261 logic elements, roughly 4.94 Mbits of embedded RAM and 376 I/Os, this device addresses applications requiring dense programmable logic, substantial local memory and broad peripheral interfacing while operating across a wide industrial temperature range.

Key Features

• Core Logic Approximately 101,261 logic elements to implement complex digital designs and custom processing pipelines.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs and local data storage for low-latency operations.
• Flexible I/O 376 I/O pins to interface with multiple peripherals and external devices without extensive external glue logic.
• Power Supply Defined operating supply range of 1.14 V to 1.26 V for the core domain.
• Package and Mounting 676-FBGA (27×27) package in a surface-mount form factor for high pin density and compact board integration.
• Industrial Temperature Rating Specified operating temperature range from –40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance RoHS compliant construction to meet common environmental requirements.

Typical Applications

• Industrial Automation Use the industrial temperature rating together with ample logic and I/O resources to implement custom control logic, sensor interfacing and protocol bridging.
• Communications and Networking Leverage on-chip memory and high I/O count for buffering, packet processing and multi-protocol handling in networking modules.
• Instrumentation and Test Deploy the FPGA for real-time data acquisition preprocessing, custom signal routing and flexible measurement logic.

Unique Advantages

• High integration density: Large logic element count and significant embedded RAM reduce the need for external components and simplify system design.
• Extensive peripheral connectivity: 376 I/Os enable direct interfacing to a wide range of sensors, transceivers and control peripherals.
• Industrial robustness: –40 °C to 100 °C operating range supports demanding deployment environments.
• Compact, high-pin-count package: 676-FBGA (27×27) delivers a small board footprint while providing many signal connections.
• Defined core supply range: 1.14 V to 1.26 V supply specification simplifies power planning for the core domain.
• RoHS compliant: Environmentally compliant manufacturing and materials.

Why Choose XC6SLX100T-3FG676I?

The XC6SLX100T-3FG676I combines a high logic element count, substantial on-chip RAM and a large I/O complement in an industrial-grade Spartan®-6 LXT FPGA. This combination makes it well suited to designs that require dense programmable logic, local memory and robust interfacing in temperature-challenging environments.

Manufactured by AMD and supplied in a compact 676-FBGA surface-mount package, the device is aimed at engineers and procurement teams building industrial control, communications and instrumentation systems that need scalable programmable logic and board-level integration.

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