XC6SLX100T-3FG900I

The XC6SLX100T-3FG900I is a Spartan®-6 LXT field programmable gate array supplied in a 900-ball BGA package for surface-mount assembly. It provides a substantial on-chip logic and memory resource set and is specified for industrial-grade operation, targeting designs that require programmable logic capacity and a wide operating temperature range.

Key Features

• Core Logic  Approximately 101,261 logic elements enable implementation of sizable custom logic and state machines within a single device.
• Logic Fabric  A large logic fabric supports complex combinational and sequential designs; device CLB structure is provided as part of the Spartan‑6 LXT architecture.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM for data buffering, FIFOs, and small embedded storage without external memory.
• I/O Capacity  498 user I/O pins to support broad peripheral and interface connectivity directly from the FPGA fabric.
• Power  Core voltage supply specified from 1.14 V to 1.26 V, enabling consistent power provisioning for the FPGA core.
• Package & Mounting  900-BBGA package (supplier device package: 900-FBGA, 31×31) designed for surface-mount PCB assembly to support compact system integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for a range of industrial environments.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control Systems  Programmable logic capacity and industrial temperature rating make this device appropriate for motor control, PLCs, and factory automation functions.
• High‑Density I/O Systems  With 498 I/O pins, the device is well suited for systems requiring extensive sensor, actuator, or peripheral interfacing.
• Embedded Prototyping and Development  Large logic and embedded memory resources support prototype implementations and iterative hardware/software co-design.

Unique Advantages

• Substantial On‑Chip Capacity: The combination of approximately 101,261 logic elements and ~4.94 Mbits of embedded RAM reduces reliance on external resources and simplifies system BOM.
• Broad I/O Connectivity: 498 user I/Os allow direct interfacing to many peripherals and sensors, minimizing intermediary components.
• Industrial Reliability: Specified −40 °C to 100 °C operation and industrial grading provide predictable behavior in harsher environments.
• Compact Packaging: 900-BBGA (900-FBGA, 31×31) supports high-density board designs while maintaining a surface-mount form factor.
• Regulatory Compliance: RoHS compliance supports lead-free assembly processes and environmental requirements.

Why Choose XC6SLX100T-3FG900I?

The XC6SLX100T-3FG900I positions itself as a high-capacity Spartan‑6 LXT FPGA option for industrial and I/O‑intensive designs. Its large logic element count and embedded memory enable consolidation of complex functions into a single programmable device, while the wide operating temperature range and RoHS compliance support robust deployment and manufacturing requirements.

This device is suited to engineers and system designers seeking scalable programmable logic for industrial control, dense I/O applications, and embedded prototyping where on-chip resources and predictable environmental performance are important considerations.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC6SLX100T-3FG900I for your next design.