XC6SLX100T-3FGG676I

The XC6SLX100T-3FGG676I is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) offered by AMD. It provides a high-capacity programmable logic fabric with significant embedded RAM and a large number of I/O in a 676-ball BGA package.

This industrial-grade FPGA is suited to designs that require substantial logic resources, on-chip memory, and a broad I/O complement, while operating across a wide supply voltage and temperature range.

Key Features

• Programmable Logic Capacity — 101,261 logic elements deliver substantial configurable logic for complex digital designs.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM (4,939,776 bits) to support data buffering, FIFOs, and local storage without external memory.
• I/O Density — 376 user I/O pins to support wide bus interfaces, multiple peripherals, and parallel connectivity.
• Power Supply Range — Core voltage support from 1.14 V to 1.26 V to match target power-rail requirements.
• Thermal and Environmental — Industrial operating temperature range from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Package and Mounting — 676-ball fine-pitch BGA (676‑FBGA, 27×27) in a surface-mount package to enable high-density PCB integration.
• Regulatory — RoHS compliant, supporting environmentally conscious manufacturing requirements.

Typical Applications

• Custom Logic Acceleration — Implement application-specific data paths and parallel processing logic using the device’s 101,261 logic elements and embedded RAM.
• High‑Density I/O Systems — Support interfaces and multi-channel connectivity with 376 user I/O pins for bridging, aggregation, or protocol handling.
• Industrial Control and Embedded Systems — Leverage the industrial temperature range and on-chip memory for reliable operation in temperature-variable industrial deployments.

Unique Advantages

• High Integration: Combines large logic capacity and nearly 5 Mbits of embedded RAM to reduce external components and simplify system design.
• Wide I/O Count: 376 I/Os enable flexible interfacing to sensors, peripherals, and external memory or communication links.
• Compact, High‑Density Package: 676‑FBGA (27×27) allows for a compact PCB footprint while retaining extensive connectivity.
• Industrial Temperature Range: Rated from -40 °C to 100 °C to support deployment in demanding thermal environments.
• Controlled Core Voltage: Narrow core supply range (1.14 V to 1.26 V) assists in predictable power design and supply selection.
• RoHS Compliant: Manufactured to meet RoHS environmental standards for lead-free assembly.

Why Choose XC6SLX100T-3FGG676I?

The XC6SLX100T-3FGG676I provides a balanced combination of large programmable logic resources, substantial on-chip memory, and a high I/O count in a compact 676‑BGA package. Its industrial temperature rating and controlled core voltage range make it a practical choice for robust, long-lived designs that require reliable operation across varied environments.

This FPGA is suitable for engineers and system designers seeking a high-capacity, industrial-grade programmable device from AMD to address complex logic, buffering, and I/O requirements while minimizing external component count.

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