XC6SLX100T-4FGG484C

The XC6SLX100T-4FGG484C is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD presented in a 484-ball BGA package. It provides a high logic capacity FPGA fabric with a large amount of embedded RAM and a substantial I/O count for dense, programmable digital designs.

With 101,261 logic elements and approximately 4.94 Mbits of embedded memory, this commercial-grade, surface-mount device is targeted at applications that require significant on-chip logic and memory resources while operating within a 0 °C to 85 °C temperature range and a 1.14 V–1.26 V core supply.

Key Features

• Core Logic 101,261 logic elements enable implementation of complex programmable logic functions and custom digital architectures.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, local data storage, and state machine implementations.
• I/O Capacity 296 user I/O pins support extensive external interfacing and connectivity to peripherals and subsystems.
• Power Core supply voltage range of 1.14 V to 1.26 V for compatibility with specified Spartan-6 LXT power domains.
• Package & Mounting 484-ball BGA package (supplier device package: 484-FBGA, 23×23) in a surface-mount format for compact board integration.
• Temperature & Grade Commercial operating range 0 °C to 85 °C; RoHS-compliant.

Typical Applications

• Communications Equipment Implement protocol processing, packet handling, and custom interface logic using high logic density and plentiful I/O.
• Embedded Systems Integrate control logic, custom accelerators, and on-chip memory to reduce external component count and simplify designs.
• Test and Measurement Use flexible FPGA resources and abundant I/O for data acquisition, signal conditioning control, and instrument control functions.
• Image and Video Processing Deploy local RAM and logic elements for buffering, pixel processing, and real-time streaming functions.

Unique Advantages

• High Logic Capacity: 101,261 logic elements enable implementation of complex, large-scale programmable designs on a single device.
• Substantial On-Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O Count: 296 I/Os provide flexibility for high-pin-count interfaces and multiple peripheral connections without external expansion.
• Compact BGA Packaging: 484-ball BGA (484-FBGA, 23×23) supports space-efficient board layouts while maintaining robust interconnectivity.
• Commercial Temperature Operation: Rated for 0 °C to 85 °C, suitable for a wide range of commercial and embedded applications.
• RoHS Compliant: Environmentally compliant manufacturing materials.

Why Choose XC6SLX100T-4FGG484C?

The XC6SLX100T-4FGG484C positions itself as a capable, high-density Spartan®-6 LXT FPGA that balances large logic capacity, meaningful embedded memory, and a high I/O count in a compact 484-BBGA surface-mount package. Its commercial-grade temperature range and RoHS compliance make it appropriate for a broad set of board-level designs that require on-chip programmability and integration.

This device is well-suited for designers looking to consolidate functionality, accelerate custom logic tasks, or prototype complex digital systems while relying on a known FPGA architecture and a well-defined set of electrical and mechanical characteristics.

Request a quote or submit an inquiry for pricing and availability of the XC6SLX100T-4FGG484C to begin integrating this Spartan®-6 LXT FPGA into your next design.