XC6SLX100T-4FGG900C

The XC6SLX100T-4FGG900C is an AMD Spartan®-6 LXT Field Programmable Gate Array (FPGA) supplied in a 900-BBGA package. It delivers high logic density and large I/O capacity in a commercial-grade, surface-mount form factor suitable for a wide range of programmable-logic designs.

Key device attributes include 7,911 CLBs, approximately 101,261 logic elements, roughly 4.94 Mbits of on-chip RAM, and up to 498 user I/O pins, providing a platform for designs that require significant embedded logic, memory, and I/O resources.

Key Features

• Core & Logic — 7,911 CLBs and approximately 101,261 logic elements support substantial digital integration and complex logic implementations.
• Embedded Memory — Approximately 4.94 Mbits of total on-chip RAM for local buffering, state storage, and data processing needs.
• I/O Capacity — Up to 498 I/O pins available for broad peripheral and interface connectivity in dense system designs.
• Power — Operates with a supply voltage range of 1.14 V to 1.26 V to match platform power requirements.
• Package & Mounting — 900-BBGA package (supplier device package: 900-FBGA, 31 × 31) with surface-mount mounting for compact board integration.
• Operating Range — Commercial grade device rated for 0 °C to 85 °C ambient operation.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Embedded Systems — Use the XC6SLX100T-4FGG900C where substantial programmable logic and on-chip RAM are required for custom control and processing functions.
• High‑I/O Interfaces — Ideal for designs that require broad external connectivity, leveraging up to 498 I/O pins for sensors, peripherals, and board-level interfaces.
• Prototyping and Development — Provides a high-density FPGA resource for validating and refining digital designs during product development cycles.

Unique Advantages

• High Logic Density: Approximately 101,261 logic elements enable implementation of complex digital functions on a single device, reducing system-level component count.
• Significant On-Chip Memory: Around 4.94 Mbits of embedded RAM supports local data buffering and state retention without external memory.
• Extensive I/O: Up to 498 I/O pins offer flexibility for connecting to multiple peripherals and subsystems.
• Compact, Surface-Mount Package: The 900-BBGA (900-FBGA, 31 × 31) package supports dense board layouts while maintaining robust electrical connections.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C operation to match typical commercial application environments.
• Regulatory Compliance: RoHS compliance helps meet environmental and manufacturing requirements.

Why Choose XC6SLX100T-4FGG900C?

The XC6SLX100T-4FGG900C combines substantial programmable logic resources, on-chip memory, and a high I/O count in a commercial-grade 900-BBGA package. These characteristics make it well suited to designs that need dense logic integration and broad external connectivity while maintaining a compact board footprint.

For engineers and procurement teams seeking a scalable, high-density FPGA solution with clear electrical and thermal parameters (1.14–1.26 V supply, 0 °C to 85 °C operating range) and RoHS compliance, this device provides a verifiable platform to support medium- to high-complexity digital designs.

Request a quote or submit a purchase inquiry to evaluate availability and pricing for the XC6SLX100T-4FGG900C.