XC6SLX100T-N3FG484I

The XC6SLX100T-N3FG484I is a Spartan®-6 LXT series Field Programmable Gate Array (FPGA) configured in a 484-BBGA package. It provides a high-density programmable fabric with 7,911 CLBs and 101,261 logic elements, along with substantial on-chip memory and I/O resources for complex logic integration.

Designed for industrial applications, this device operates from a core supply range of 1.14 V to 1.26 V and across an operating temperature range of -40 °C to 100 °C, making it suitable for robust embedded and industrial designs that require deterministic programmable logic and significant local memory.

Key Features

• Core Logic  7,911 CLBs delivering 101,261 logic elements for implementing complex digital functions and custom logic pipelines.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs, and localized data storage without external memory.
• I/O Capacity  296 available I/O pins to connect a broad range of peripherals, interfaces, and board-level signals.
• Power Supply  Operates from a core voltage supply range of 1.14 V to 1.26 V, enabling predictable power design around the FPGA core.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23 × 23) with surface-mount mounting for high-density PCB layouts.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C, suitable for thermally demanding environments.
• Regulatory Compliance  RoHS compliant to support environmentally conscious manufacturing and regulatory requirements.

Unique Advantages

• High logic density: 101,261 logic elements provide the capacity to consolidate multiple functions into a single programmable device, reducing BOM count.
• Significant on-chip memory: Approximately 4.94 Mbits of embedded RAM minimizes reliance on external memory for many buffering and storage needs.
• Generous I/O resources: 296 I/O pins simplify board-level interfacing and enable flexible connectivity for mixed-signal and digital peripherals.
• Industrial-rated operation: -40 °C to 100 °C rating supports deployment in harsh or industrial-grade systems.
• Compact BGA package: 484-BBGA (484-FBGA, 23 × 23) supports high-density PCB designs while providing the pin count required for complex systems.
• Environmental compliance: RoHS status supports reuse in compliant manufacturing flows.

Why Choose XC6SLX100T-N3FG484I?

The XC6SLX100T-N3FG484I combines substantial logic capacity, embedded memory, and a high I/O count in a compact BGA package, targeting industrial designs that need deterministic, reconfigurable logic close to the application. Its specified voltage range and wide operating temperature make it appropriate for long-life deployments where reliability and environmental tolerance are important.

This FPGA suits engineers and system designers seeking a robust, high-density programmable device that consolidates functions, reduces external components, and supports industrial operating conditions while aligning with RoHS requirements.

Request a quote or submit an inquiry to sales to get pricing, availability, and technical support for integrating the XC6SLX100T-N3FG484I into your next design.