XC6SLX100T-N3FG900I

The XC6SLX100T-N3FG900I is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD provided in a 900-BBGA package. It offers a high logic capacity and substantial on-chip memory for demanding industrial applications.

With 101,261 logic elements, approximately 4.94 Mbits of embedded memory, and 498 user I/O, this device is intended for system designs that require dense logic, significant local storage, and broad I/O connectivity within an industrial temperature range.

Key Features

• Core Logic 101,261 logic elements provide programmable resources for custom digital logic, protocol implementation, and glue logic tasks.
• Embedded Memory Approximately 4.94 Mbits of on-chip RAM supports buffering, FIFOs, and local data storage for logic-intensive designs.
• I/O Capacity 498 available I/O pins enable extensive external interfacing for sensors, peripherals, and parallel or serial I/O buses.
• Power Operates from a core supply range of 1.14 V to 1.26 V, allowing designers to plan power distribution and regulator selection precisely.
• Package & Mounting 900-BBGA (supplier package: 900-FBGA, 31×31) in a surface-mount form factor for high-density board integration.
• Industrial Temperature Range Rated for operation from –40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
• Compliance RoHS compliant, supporting lead-free assembly and regulatory requirements for many product lines.

Typical Applications

• Industrial Control and Automation — High logic capacity and industrial temperature rating allow implementation of custom control logic, state machines, and interface aggregation in industrial equipment.
• Communications and Networking — Large I/O count and on-chip memory support protocol bridging, packet buffering, and glue logic for networking modules and embedded communications systems.
• Test & Measurement — Dense logic and embedded RAM enable real-time signal processing, data acquisition control, and instrument interfacing within industrial environments.

Unique Advantages

• High Logic Density: 101,261 logic elements provide a substantial programmable fabric for complex custom digital designs, reducing the need for multiple discrete devices.
• Significant On-Chip Memory: Approximately 4.94 Mbits of embedded RAM supports local buffering and temporary storage, simplifying external memory requirements.
• Extensive I/O: 498 I/O pins enable broad peripheral connectivity and system integration without excessive external multiplexing.
• Industrial Robustness: –40 °C to 100 °C operating range and industrial grade classification make the device suitable for harsh-environment deployments.
• Compact Packaging: 900-BBGA in a 31×31 supplier footprint offers high pin count in a compact surface-mount package for dense PCB designs.
• Regulatory Compatibility: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC6SLX100T-N3FG900I?

The XC6SLX100T-N3FG900I balances high logic capacity, substantial embedded memory, and a large I/O count in a compact 900-BBGA package, making it well suited for industrial designs that require programmable flexibility and robust operation across a wide temperature range. Its defined core voltage range and surface-mount package simplify power and mechanical integration into production boards.

This device is appropriate for designers and teams building industrial control systems, communications modules, or test equipment that need scalable logic resources and on-chip memory while maintaining compliance with RoHS and industrial temperature requirements. Backed by AMD as the manufacturer, it fits into workflows that require long-lifecycle component planning and established FPGA toolchains.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the XC6SLX100T-N3FG900I. Combined with your design requirements, our team can help specify the right quantity and delivery schedule for your project.