XC6SLX100T-N3FGG900I

The XC6SLX100T-N3FGG900I is a Spartan®-6 LXT field programmable gate array (FPGA) provided in a 900-ball BGA package. It delivers high logic density and substantial on-chip memory for industrial embedded designs.

With approximately 101,261 logic elements, roughly 4.94 Mbits of embedded memory and 498 I/O, this device targets designs that require significant programmable logic, plentiful I/O connectivity and operation across an industrial temperature range.

Key Features

• Core Logic  Approximately 101,261 logic elements for implementing complex programmable logic and custom hardware functions.
• Configurable Logic Blocks  7,911 logic block resources (as specified) to structure combinational and sequential logic fabric.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, FIFOs and data-path storage without external memory.
• I/O Capacity  498 I/O pins to accommodate wide data buses, multiple peripherals and high-channel-count interfaces.
• Power Supply  Core voltage supply range of 1.14 V to 1.26 V for the device core domain.
• Package & Mounting  900-BBGA package (supplier device package: 900-FBGA, 31×31) in a surface-mount form factor for board-level integration.
• Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C, suitable for demanding ambient conditions.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use in motor control, PLCs and factory automation where industrial-grade temperature range and robust logic capacity are required.
• High-Density I/O Systems  Ideal for applications needing many parallel interfaces or wide data buses, leveraging the device's 498 I/O pins.
• Embedded Memory-Intensive Designs  On-chip RAM (approximately 4.94 Mbits) supports buffering and local data storage for embedded signal processing tasks.
• Custom Logic and Prototyping  Suitable for implementing custom accelerators, protocol bridges and specialized hardware functions using its large logic element count.

Unique Advantages

• High Logic Density: Approximately 101k logic elements enable implementation of sizeable custom logic and parallel processing blocks on a single device.
• Substantial On-Chip Memory: Nearly 4.94 Mbits of embedded RAM reduces dependency on external memory for many buffering and streaming tasks.
• Extensive I/O Resources: 498 I/O pins allow flexible connectivity for multi-channel interfaces, sensors and peripheral integration, simplifying board-level routing.
• Industrial Reliability: Rated for -40 °C to 100 °C operation and specified as industrial grade for deployment in harsh or temperature-variable environments.
• Compact Surface-Mount Package: 900-BBGA (900-FBGA, 31×31) provides a high-density package suitable for space-constrained PCBs while supporting robust solder mounting.
• Regulatory Consideration: RoHS compliance supports environmentally conscious product designs and regulatory requirements.

Why Choose XC6SLX100T-N3FGG900I?

The XC6SLX100T-N3FGG900I positions itself as a high-capacity Spartan®-6 LXT FPGA option for industrial and embedded designs that require significant programmable logic, abundant I/O and meaningful on-chip memory. Its combination of approximately 101,261 logic elements, roughly 4.94 Mbits of embedded RAM and 498 I/O pins supports complex custom logic implementations while reducing external component count.

Designed for industrial operation with a -40 °C to 100 °C range, a 1.14–1.26 V core supply and a compact 900-BBGA surface-mount package, the device offers scalability and board-level integration suitable for production deployments and long-term projects.

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