XC6SLX100T-N3FGG484I

IC FPGA 296 I/O 484FBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 4939776 101261 484-BBGA

Quantity 375 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O296Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7911Number of Logic Elements/Cells101261
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4939776

Overview of XC6SLX100T-N3FGG484I – Spartan®-6 LXT FPGA, 484-BBGA

The XC6SLX100T-N3FGG484I is a Spartan®-6 LXT field-programmable gate array (FPGA) from AMD, supplied in a compact 484-BBGA package. It provides a high density of programmable logic and embedded memory, combined with a wide operating temperature range and industrial-grade qualification for demanding environments.

Designed for applications that need substantial on-chip resources and I/O capacity, this device balances logic density, embedded RAM, and I/O count while operating from a low-voltage core supply.

Key Features

  • Logic Capacity  Approximately 101,261 logic elements available for implementing custom digital functions and complex processing pipelines.
  • Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
  • I/O Density  296 user I/O pins to interface with peripherals, sensors, and external devices in high-connectivity designs.
  • Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) optimized for surface-mount assembly to save board space.
  • Power  Core supply voltage range of 1.14 V to 1.26 V to support low-voltage system architectures.
  • Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial temperature requirements.
  • Regulatory  RoHS-compliant construction for reduced environmental impact and regulatory compatibility.

Unique Advantages

  • High logic density: Approximately 101,261 logic elements enable highly integrated digital designs and complex FPGA implementations.
  • Substantial on-chip RAM: About 4.94 Mbits of embedded memory reduces reliance on external RAM, simplifying BOM and improving latency.
  • Extensive I/O count: 296 I/O pins provide flexibility for connecting multiple interfaces and peripherals without immediate need for additional expanders.
  • Industrial temperature capability: Rated −40 °C to 100 °C to support deployment in industrial and harsh-temperature applications.
  • Compact BGA footprint: 484-BBGA (23×23) package enables dense PCB designs where board area is at a premium.
  • Low-voltage core: 1.14 V to 1.26 V supply range aligns with modern low-voltage power domains for efficient system integration.

Why Choose XC6SLX100T-N3FGG484I?

The XC6SLX100T-N3FGG484I offers a balanced combination of logic capacity, embedded memory, and I/O resources in a compact, surface-mount 484-BBGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust embedded and industrial applications that require reliable operation across a wide thermal range.

Manufactured by AMD, this Spartan®-6 LXT FPGA is well suited to engineering teams who need scalable programmable logic, on-chip memory, and substantial I/O connectivity in a single device—helping to reduce board complexity while preserving design flexibility.

Request a quote or submit a request to receive pricing and availability information for the XC6SLX100T-N3FGG484I.

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