XC6SLX100T-N3FGG484I
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 4939776 101261 484-BBGA |
|---|---|
| Quantity | 375 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 296 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7911 | Number of Logic Elements/Cells | 101261 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4939776 |
Overview of XC6SLX100T-N3FGG484I – Spartan®-6 LXT FPGA, 484-BBGA
The XC6SLX100T-N3FGG484I is a Spartan®-6 LXT field-programmable gate array (FPGA) from AMD, supplied in a compact 484-BBGA package. It provides a high density of programmable logic and embedded memory, combined with a wide operating temperature range and industrial-grade qualification for demanding environments.
Designed for applications that need substantial on-chip resources and I/O capacity, this device balances logic density, embedded RAM, and I/O count while operating from a low-voltage core supply.
Key Features
- Logic Capacity Approximately 101,261 logic elements available for implementing custom digital functions and complex processing pipelines.
- Embedded Memory Approximately 4.94 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
- I/O Density 296 user I/O pins to interface with peripherals, sensors, and external devices in high-connectivity designs.
- Package & Mounting 484-BBGA package (supplier device package: 484-FBGA, 23×23) optimized for surface-mount assembly to save board space.
- Power Core supply voltage range of 1.14 V to 1.26 V to support low-voltage system architectures.
- Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial temperature requirements.
- Regulatory RoHS-compliant construction for reduced environmental impact and regulatory compatibility.
Unique Advantages
- High logic density: Approximately 101,261 logic elements enable highly integrated digital designs and complex FPGA implementations.
- Substantial on-chip RAM: About 4.94 Mbits of embedded memory reduces reliance on external RAM, simplifying BOM and improving latency.
- Extensive I/O count: 296 I/O pins provide flexibility for connecting multiple interfaces and peripherals without immediate need for additional expanders.
- Industrial temperature capability: Rated −40 °C to 100 °C to support deployment in industrial and harsh-temperature applications.
- Compact BGA footprint: 484-BBGA (23×23) package enables dense PCB designs where board area is at a premium.
- Low-voltage core: 1.14 V to 1.26 V supply range aligns with modern low-voltage power domains for efficient system integration.
Why Choose XC6SLX100T-N3FGG484I?
The XC6SLX100T-N3FGG484I offers a balanced combination of logic capacity, embedded memory, and I/O resources in a compact, surface-mount 484-BBGA package. Its industrial temperature rating and RoHS compliance make it suitable for robust embedded and industrial applications that require reliable operation across a wide thermal range.
Manufactured by AMD, this Spartan®-6 LXT FPGA is well suited to engineering teams who need scalable programmable logic, on-chip memory, and substantial I/O connectivity in a single device—helping to reduce board complexity while preserving design flexibility.
Request a quote or submit a request to receive pricing and availability information for the XC6SLX100T-N3FGG484I.

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