XC6SLX100T-N3FG676I

The XC6SLX100T-N3FG676I is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD, supplied in a 676-ball fine-pitch BGA (27×27) package. This industrial-grade, surface-mount device provides a combination of high logic capacity, on-chip memory, and a large number of I/O for designs that require substantial programmable logic and I/O integration.

With 101,261 logic elements and approximately 4.94 Mbits of embedded memory, the device is suited to designs that demand dense logic resources, extensive on-chip RAM, and broad external connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity — 101,261 logic elements provide substantial programmable logic resources for complex designs.
• Embedded Memory — Approximately 4.94 Mbits of on-chip RAM to support data buffering, state storage, and local memory needs.
• I/O Count — 376 user I/O pins to accommodate high channel counts, multiple interfaces, and extensive connectivity.
• Power — Supported core supply voltage range of 1.14 V to 1.26 V for compatibility with targeted power domains.
• Package and Mounting — 676-FBGA package (27×27 mm) designed for surface-mount PCB assembly and high-density board layouts.
• Industrial Grade and Temperature Range — Rated for industrial use with an operating temperature range of −40 °C to 100 °C for demanding environments.
• Standards Compliance — RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Industrial Control — Use the device for programmable control logic and I/O aggregation in factory automation and machine control systems, leveraging its industrial temperature rating.
• Data Buffering and Processing — Employ the substantial on-chip RAM and logic capacity for buffering, data path processing, and custom packet handling in communication subsystems.
• I/O-Intensive Designs — Integrate multiple interfaces and peripheral channels using the 376 available I/O pins for sensor hubs, interface bridging, or board-level I/O consolidation.
• System Integration — Consolidate discrete logic and glue functions onto a single FPGA to reduce BOM and simplify PCB routing with the high logic density and BGA package.

Unique Advantages

• High Logic Density: 101,261 logic elements enable implementation of complex digital functions without external ASICs or gate arrays.
• Significant On-Chip Memory: Approximately 4.94 Mbits of embedded RAM supports local data storage and reduces dependency on external memory.
• Extensive I/O Count: 376 I/O pins provide flexibility for multi-channel interfaces, reducing the need for additional interface chips.
• Industrial Reliability: Rated for operation from −40 °C to 100 °C, suitable for deployment in industrial temperature environments.
• Compact, Board-Level Packaging: 676-FBGA (27×27) enables dense PCB layouts while maintaining robust soldered connections for surface-mount assembly.
• Manufacturing Compliance: RoHS compliance facilitates integration into lead-free production flows.

Why Choose XC6SLX100T-N3FG676I?

The XC6SLX100T-N3FG676I positions itself as a high-capacity, industrial-grade FPGA option for designs that require a balanced combination of logic resources, embedded memory, and extensive I/O in a compact BGA package. Its voltage and temperature ratings, along with RoHS compliance, make it suitable for long-term production in industrial applications where reliability and manufacturability matter.

This device is well suited for engineers and teams looking to consolidate system functions, implement complex custom logic, and support multiple interfaces on a single programmable device while maintaining the environmental and assembly characteristics needed for industrial deployments.

Request a quote or submit an inquiry to get pricing and availability for the XC6SLX100T-N3FG676I and discuss how it can fit into your next design.