XC6SLX100T-N3FGG676I

The XC6SLX100T-N3FGG676I is a Spartan®-6 LXT field programmable gate array (FPGA) in a 676-ball BGA package designed for demanding embedded logic applications. It delivers a high capacity of programmable logic and embedded memory while supporting industrial temperature operation and a narrow core supply range for controlled power design.

Key Features

• Logic Capacity  Approximately 101,261 logic elements organized across 7,911 CLBs, enabling complex custom logic implementations.
• Embedded Memory  Approximately 4.94 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
• I/O Density  376 user I/O pins to accommodate wide parallel interfaces and multiple external peripheral connections.
• Power  Core voltage supply range of 1.14 V to 1.26 V for the device core, suitable for controlled-power system designs.
• Package & Mounting  676-FBGA (27 × 27 mm) BGA package in a surface-mount form factor for space-efficient board layouts.
• Operating Range  Rated for industrial operation from −40 °C to 100 °C, supporting deployment in temperature-challenging environments.
• Environmental Compliance  RoHS-compliant construction to meet common environmental and manufacturing requirements.

Typical Applications

• Custom Embedded Logic  Implement application-specific datapaths, protocol bridges, and hardware accelerators using the device's large logic and memory resources.
• High‑Pin Count Interfaces  Support wide parallel buses and multiple peripheral interfaces with 376 user I/Os.
• Industrial Control & Automation  Deploy in control systems that require programmable logic and operation across an industrial temperature range.

Unique Advantages

• High Logic Density: ~101,261 logic elements provide headroom for complex designs without external programmable logic.
• Substantial On‑Chip Memory: Approximately 4.94 Mbits of embedded RAM reduces dependence on external memory for many use cases.
• Large I/O Count: 376 I/Os simplify integration of multiple peripherals and wide parallel interfaces, lowering PCB complexity.
• Industrial Temperature Support: −40 °C to 100 °C rating supports applications that must operate across extended temperature ranges.
• Compact BGA Package: 676-FBGA (27×27 mm) enables dense system integration while maintaining a surface-mount assembly.
• Regulatory Readiness: RoHS compliance aligns with common manufacturing and environmental requirements.

Why Choose XC6SLX100T-N3FGG676I?

The XC6SLX100T-N3FGG676I balances significant programmable logic capacity, meaningful on-chip memory, and a high I/O count in a compact 676-BGA package suited for industrial temperature environments. Its controlled core voltage range and RoHS-compliant construction make it appropriate for engineers seeking a robust, tightly integrated FPGA solution for mid- to high-complexity designs.

This device is well suited to development teams and procurement groups building custom embedded logic, interface bridging, or industrial control solutions that require scaleable logic resources, local memory, and a high number of external connections while maintaining compact board footprint and industrial operating capability.

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